P
Phil Hobbs
Guest
On 09/16/2014 01:36 PM, DecadentLinuxUserNumeroUno wrote:
I generally need the free ground plane you get from doing the Cu-clad
thing, but your method is not at all a bad way to handle SMTs. Nice.
Cheers
Phil Hobbs
--
Dr Philip C D Hobbs
Principal Consultant
ElectroOptical Innovations LLC
Optics, Electro-optics, Photonics, Analog Electronics
160 North State Road #203
Briarcliff Manor NY 10510
hobbs at electrooptical dot net
http://electrooptical.net
On Tue, 16 Sep 2014 08:45:50 -0400, Phil Hobbs
hobbs@electrooptical.net> Gave us:
On 9/15/2014 9:34 PM, DecadentLinuxUserNumeroUno wrote:
On Mon, 15 Sep 2014 17:46:03 -0700 (PDT), George Herold
gherold@teachspin.com> Gave us:
On Monday, September 15, 2014 3:03:36 PM UTC-4, Don Kuenz wrote:
Do you personally use a plastic solderless breadboard for your
prototypes?
http://www.ebay.com/sch/items/?_nkw=solderless+breadboard
If not, what do you use for your prototypes?
TIA.
Every once in a while, to test something simple, or a simple circuit.
(But I usually regret it, when some wire/connections gets flaky.)
Then it turns into live bug air wires over copper clad.
George H.
--
Don Kuenz
"Dead Bug" is legs up. It is also what you should use from the start,
with form factors being as small as they are these days.
I find that I can do dead bug with 50-mil pitch parts (such as SOICs and
SOT23s) by staggering the leads like saw teeth. The main problem is
that the leads are so fragile, whereas with DIPs you can just solder a
resistor to a pin and bend it anywhere you like without worrying.
Anything smaller than 50 mils is extremely difficult, so breakout boards
come in very handy. For devices where those don't work well (e.g. SC70
microwave transistors), it's sometimes possible to wire them up dead-bug
fashion with 0603s in midair, but that's very fiddly.
Cheers
Phil Hobbs
I place and wire small sub-circuits onto little silica heat sink tabs
and other ceramic wafers. I glue them down with PCB SMD component
adhesive or simple superglue, If I have already done all the soldering
between nodes, and will not be introducing any more heat.
http://www.mediafire.com/view/nxtztsxh47ug7fp/ceramic.JPG#
I generally need the free ground plane you get from doing the Cu-clad
thing, but your method is not at all a bad way to handle SMTs. Nice.
Cheers
Phil Hobbs
--
Dr Philip C D Hobbs
Principal Consultant
ElectroOptical Innovations LLC
Optics, Electro-optics, Photonics, Analog Electronics
160 North State Road #203
Briarcliff Manor NY 10510
hobbs at electrooptical dot net
http://electrooptical.net