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On 17 Apr 2006 22:03:58 -0700, "Andrew FPGA"
<andrew.newsgroup@gmail.com> wrote:
http://www.xilinx.com/bvdocs/appnotes/xapp623.pdf
According to this power distribution app note, page 12, placement of
termination resistors takes precedence over decoupling caps. The DCI
reference resistors function like termination resistors.
I have designed four different working boards using Virtex II Pro
and/or Virtex 4 chips, and always put the DCI resistors closest to the
FPGA on the ball layer. I can usually squeeze in a bunch of 0.01uF
0402 caps in the first ring around the FPGA perimeter on the ball
layer. More 0.01uF caps on the bottom layer. Next ring has 0.1uF
caps on ball and bottom layers, etc.
I always use side vias to power and gnd planes on my decoupling caps
(Page 6) to minimize inductance. Never have room for two vias per cap
lead (Fig 6D).
Do a search on "DCI" in the Xilinx Answers database for more info.
Hope this is helpful.
<andrew.newsgroup@gmail.com> wrote:
Great resource for decoupling cap placement and component priorities:Hi,
I have been unable to find any info/guidelines for PCB placement of the
DCI reference resistors. I.e. the resistors that attach to VRN and VRP.
My instinct says decoupling capacitors highest priority (closest to
FPGA package), DCI resistors next priority, and everything else lowest
priority.
How senstive to noise are the VRP/VRN inputs?
FPGA is XC3S200-4FT256 and I'm using 49R9 DCI reference resistors.
Regards
Andrew
http://www.xilinx.com/bvdocs/appnotes/xapp623.pdf
According to this power distribution app note, page 12, placement of
termination resistors takes precedence over decoupling caps. The DCI
reference resistors function like termination resistors.
I have designed four different working boards using Virtex II Pro
and/or Virtex 4 chips, and always put the DCI resistors closest to the
FPGA on the ball layer. I can usually squeeze in a bunch of 0.01uF
0402 caps in the first ring around the FPGA perimeter on the ball
layer. More 0.01uF caps on the bottom layer. Next ring has 0.1uF
caps on ball and bottom layers, etc.
I always use side vias to power and gnd planes on my decoupling caps
(Page 6) to minimize inductance. Never have room for two vias per cap
lead (Fig 6D).
Do a search on "DCI" in the Xilinx Answers database for more info.
Hope this is helpful.