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I used to service some graphics computing equipment there in the 80s ...I just noticed the production date on my roll of tungsten wire - 1954, I
think it came from auction sell off of stuff at CEGB Marchwood,Hampshire
labs
Yep, bang on. Wire wrapping wire primary purpose, revision wire for ECOsArfa Daily wrote:
If by 'compatible' you mean solderable, then yes, etch revision wire is.
That sounds like the 30 AWG wire that used to be used to wrap wire
backplanes. I have several rolls of solid wire in that size that is
tinned, and has a thermoplastic insulator, commonly used for ECOs
(Engineering Change Order)
--
Anyone wanting to run for any political office in the US should have to
have a DD214, and a honorable discharge.
Very possibly, but I'm sure that I did post it somewhere on this group asOn 25/07/2013 01:43, Arfa Daily wrote:
"N_Cook" <diverse@tcp.co.uk> wrote in message
news:ksopo3$p5q$1@dont-email.me...
I discovered this via needing to isolate Vcc of a SOIC where the trace
is under the IC and a multilayer board.
I have a reel of 0.08mm diameter tungsten wire , tungsten probably
not critical and diameter only needs to be small enough to go under
SOIC pins.
I've since tried, pin by pin, of an 8p SOIC on a scrap board with a
success rate of 8 out of 8 isolating each pin , first time. Leaded
solder, PbF situation not tried yet
Feed length of the wire under a pin , long enough to grab hold of both
ends. Pull outwards and slightly upward while quick soldering iron
melt of the pin solder. The wire pulls through, but surprisingly , 8
out out 8 times so far, the solder has not rejoined across the gap.
Then a sliver of mica under the pin , in my Vcc situation, to fully
isolate for testing purposes.
But of course where hot air is out of the question , the IC is
required for salvaged re-use etc, this method pin by pin could be used
even in restricted space,
to salvage a whole SMD IC. I wonder if a single loop per side of a DIL
or quad footprint IC , and progressive single pin melting , would work
with 8 or more pins in one operation - worth trying some time
I detailed this procedure a long long time ago on here. I use
etch-revision wire, fed under the pins, and tacked to a convenient
solder point at the far end. With the wire pulled against the first pin,
and slightly upwards, applying the tip of the iron to the pins in quick
succession results in them popping off the board remarkably easily and
cleanly. I have used this technique with total success to remove SM ICs
without physically damaging them , and where hot air cannot be used, for
many years now.
Arfa
"here" being usenet but on uk.d-i-y, end apr 2013, a place I rarely visit
except to post a buildings type query