Solid State Relays and EMI

"Arie de Muynck" <Sorry_I_hate_spam@nomail.com> wrote in message news:<41055900$0$34762$e4fe514c@news.xs4all.nl>...

Did you alrady do the test with the 1nF between driver size and output side?

Regards,
Arie de Muynck
Which pins are you suggesting I apply it across? Input ground to output ground?

Dave
 
"David Harper" ...
"Arie de Muynck" ...

Did you alrady do the test with the 1nF between driver size and output
side?

Which pins are you suggesting I apply it across? Input ground to output
ground?


Yes. The basic idea is to minimize the RF voltage occurring across the
isolation barrier by shorting it with the cap.
Input GND to output GND is best, to other points it might cause other EMC
problems.

It _may_ help to also put a ceramic 1nF cap across the output. This lowers
the RF voltage across the FETs, half of which would be present at the output
side of the isolation barrier. But it will decrease the output impedance,
so it's a second choice solution only.

Regards,
Arie de Muynck
 
Robert Baer <robertbaer@earthlink.net> wrote:
Be advised that relays made with copper (a *solid*), iron (a *solid*),
sometimes plastic (a *solid*) and sometimes glass (a *solid*) ARE SOLID
STATE (certainly *not* gas state or liquid state)...
Which brings up the age-old question: Just how {anal-retentive,
deliberately wrong} can one be on Usenet before crossing the line into
"troll"?

--
William Smith
ComputerSmiths Consulting, Inc. www.compusmiths.com
 
On Mon, 26 Jul 2004 08:46:27 -0700, Jim Thompson
<thegreatone@example.com> wrote:

On 26 Jul 2004 08:37:41 -0700, dave.harper@gmail.com (David Harper)
wrote:

Robert Baer <robertbaer@earthlink.net> wrote in message news:<4104A89A.BFE90C12@earthlink.net>...
[snip]
Your original statement about them being "solid" and not "gas" or
"liquids" was obvious, and came from left field.

I don't think anyone
reading this thread would go into Radio Shack and ask for "liquid
relays".

Dave

Burridge might ;-)
Mercury-wetted?

It's OT gents.

RL
 
On 27 Jul 2004 09:07:30 -0700, dave.harper@gmail.com (David Harper)
wrote:

"Arie de Muynck" <Sorry_I_hate_spam@nomail.com> wrote in message news:<41055900$0$34762$e4fe514c@news.xs4all.nl>...

Did you alrady do the test with the 1nF between driver size and output side?

Regards,
Arie de Muynck

Which pins are you suggesting I apply it across? Input ground to output ground?
I think he meant to the common terminal (pin5), from various places in
the circuit, including possibly an input drive rail.

RL
 
"Chris S." <chrisks@NOSPAMudel.edu> wrote in message news:<ce2pvg$d8p$1@scrotar.nss.udel.edu>...
I wouldn't necessarily classify MEMS devices as solid-state. While
certain types make use of "bending" to move small actuators, they still
rely on this movement to perform their function. The characteristic I
typically associate with solid-state is a lack of dependence on physical
motion to function.
Tubes move electrons to function, semiconductors move holes to function :).

Tim.
 

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