M
Michael Black
Guest
"PeteS" (ps@fleetwoodmobile.com) writes:
Michael
And I'm sure many have learned this the hard way.A great number of newer devices come in 'FlipChip' packages, where the
'lid' of the chip is immediately above the die - this is done for
effective thermal transfer to heat sinks - these are easy to dissect -
pop the heat sink off for many of them, and the die os there for you to
see.
Cheers
PeteS
Michael