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Ricky <gnuarm.deletethisbit@gmail.com> wrote in
news:3715ba7e-c395-4c2d-99d2-1e581eb4e383n@googlegroups.com:
snip
Blame RoHS. They disrupted the entire industry. Metallic based
lead is not an environmental hazard. Otherwise the water tables
around gun ranges (and land fills) would all be overtly contaminated
and they are not.
These are typical problems associated with lead free reflow
soldering, which requires higher temperatures, but faster ovens to
keep the thermal introduction into the parts low. Caused problems for
the polymers the industry uses as well. Some no longer work well,
some no way.
If the ovens get set too fast a solder joint can appear to be good,
but not be in actuality. And the acceptance standards allow a grainy
look to be a pass as well. Both things I do not like to see, and
this is one very good example of why.
We do not see any mobo makers running their ovens too fast.
A tray full of these cheap things though can endure higher fail
rates both at the factory and in the field, so they crank the ovens
up to increse output and thus profit from the contractor.
Also, paste has an aging time limit both for exposed time in use
and overall expiration time even in storage. So if the paste is out
too long, flux based reflow failure can mount (or fail to mount).
news:3715ba7e-c395-4c2d-99d2-1e581eb4e383n@googlegroups.com:
snip
Looking at the image in detail, it would appear you are right.
The solder doesn\'t look broken to me, it looks like it molded
around the contact, but never was a good solder joint. It
probably never really wetted the crystal contacts.
Blame RoHS. They disrupted the entire industry. Metallic based
lead is not an environmental hazard. Otherwise the water tables
around gun ranges (and land fills) would all be overtly contaminated
and they are not.
These are typical problems associated with lead free reflow
soldering, which requires higher temperatures, but faster ovens to
keep the thermal introduction into the parts low. Caused problems for
the polymers the industry uses as well. Some no longer work well,
some no way.
If the ovens get set too fast a solder joint can appear to be good,
but not be in actuality. And the acceptance standards allow a grainy
look to be a pass as well. Both things I do not like to see, and
this is one very good example of why.
We do not see any mobo makers running their ovens too fast.
A tray full of these cheap things though can endure higher fail
rates both at the factory and in the field, so they crank the ovens
up to increse output and thus profit from the contractor.
Also, paste has an aging time limit both for exposed time in use
and overall expiration time even in storage. So if the paste is out
too long, flux based reflow failure can mount (or fail to mount).