J
John Larkin
Guest
On Fri, 21 Feb 2020 20:28:19 +0000, David Nadlinger
<david@klickverbot.at> wrote:
Both. I'm using EPC BGA GaN fets, and they are very fragile. A tiny
bump can knock them off the board, or fracture the chip. They are like
little glass blocks with sharp corners.
We need better epoxy, higher viscosity to cover all the parts, and a
nice way to dispense in production. Maybe a pump nozzle on our Tormach
n/c mill?
I expect a panel of rev C of this board any day now. It has been
tweaked some, big learning curve, but we need it to be done soon. I
think the virus in China has messed up the entire PCB industry.
--
John Larkin Highland Technology, Inc
picosecond timing precision measurement
jlarkin att highlandtechnology dott com
http://www.highlandtechnology.com
<david@klickverbot.at> wrote:
On 21.02.20 7:50 pm, John Larkin wrote:
Here's a pulse generator output stage, as a mouse-bite component.
https://www.dropbox.com/s/w9ax8q9u00obnx4/T577_Glob_2.jpg?raw=1
Is that epoxy top for mechanical robustness of some (presumably GaN)
chip, or just for IP protection reasons?
David
Both. I'm using EPC BGA GaN fets, and they are very fragile. A tiny
bump can knock them off the board, or fracture the chip. They are like
little glass blocks with sharp corners.
We need better epoxy, higher viscosity to cover all the parts, and a
nice way to dispense in production. Maybe a pump nozzle on our Tormach
n/c mill?
I expect a panel of rev C of this board any day now. It has been
tweaked some, big learning curve, but we need it to be done soon. I
think the virus in China has messed up the entire PCB industry.
--
John Larkin Highland Technology, Inc
picosecond timing precision measurement
jlarkin att highlandtechnology dott com
http://www.highlandtechnology.com