R
Robert Lacoste
Guest
For anyone interested, one of my last own articles on the "toaster oven"
subject is available online here :
http://www.circuitcellar.com/library/print/0704/Lacoste_168/index.htm
Friendly yours,
Robert
"Rich Grise" <richgrise@example.net> a écrit dans le message de news:
pan.2005.01.05.03.39.00.80892@example.net...
subject is available online here :
http://www.circuitcellar.com/library/print/0704/Lacoste_168/index.htm
Friendly yours,
Robert
"Rich Grise" <richgrise@example.net> a écrit dans le message de news:
pan.2005.01.05.03.39.00.80892@example.net...
On Tue, 04 Jan 2005 11:25:26 -0600, Rob Gaddi wrote:
As bad of an idea as it sounds, I've had a lot of luck just using my
heat gun at its hottest setting and paste to solder thermal tabs. I
just design the pad with an array of the smallest vias that my fab can
support, lay a little dab of paste at the middle of the part with a
little more on a corner pin, and use the part to press it out across the
thermal contact, and then use the gun at a distance to slowly heat the
board, inching the gun closer until I see paste at the pin reflow. I
give it a few seconds after the pin goes, then switch the gun over to
cold and pray that I haven't roasted my chip. Hasn't failed yet.
Also, if you can provide heat from underneath to supplement the heat
from above it helps heat the board more evenly. Being surrounded by
scientists I've got access to chemistry hot plates, but a range and
cheap skillet should work just as well.
I'm still recovering from the shock I went into when people reported that
they routinely solder whole boards in one whump in a TOASTER
OVEN!!!!!!!!!!!
shudder
Rich