Choosing FPGAs: Xilinx vs Altera vs Actel vs Lattice

rickman wrote:
Jim Granville wrote:

rickman wrote:
snip

I have one socket on a board that Xilinx could not fill. I needed 5
volt compatibility in a relatively low power device. All of the newer
(read supported by current software) devices that are 5 volt tolerant
have a power on current surge that makes it hard to use in a low power
design without extra circuitry. So I ended up using an Altera ACEX
(EP1K) device which is only about 3-4 years old. Otherwise their newer
chips are mostly similar.

.. Perhaps the new Virtex-4 that Peter A. is dying to tell us about also
solves the 5V i/o issues ;)


I can assure you that it does not. The problem is twofold, 1) with the
thinner oxides that are being used, it gets harder and harder to provide
5 volt tolerance without adding processing steps which drives up the
cost and 2) 5 volt tolerance is becomming less and less important as
various standards evolve away from the use of 5 volt interfaces.

It has been explained to me several times that in the FPGA world, they
had two choices, retain 5 volt tolerance or compete effectively in the
high dollar, most current technology markets.
You may have missed my smiley ? ;)
-jg
 
Is there some way of comparing how big Altera devices are versus
Xilinx devices. Whereas Xilinx lists the "System Gates", Altera lists
logic elements. So, I am not sure how to equate the product families
from the two vendors. Any help will be appreciated.

Thanks
Sumit
 
On Thu, 05 Aug 2004 18:00:07 -0700, Sumit wrote:

Is there some way of comparing how big Altera devices are versus
Xilinx devices. Whereas Xilinx lists the "System Gates", Altera lists
logic elements. So, I am not sure how to equate the product families
from the two vendors. Any help will be appreciated.

Thanks
Sumit
They are both based on 4 input LUTs, if you do a little math you can
figure out how many LUTs they have in a device. As a first
approximation this is a pretty good measure. Comparing the RAM is little
easier since they both specify the number of bits of Block RAM although
you have to take into account that Xilinx LUTs can also be used as RAM
whereas Altera uses dedicated small Block RAMs instead of LUT RAMs.
 
Jim Granville wrote:
rickman wrote:
Jim Granville wrote:

rickman wrote:
snip

I have one socket on a board that Xilinx could not fill. I needed 5
volt compatibility in a relatively low power device. All of the newer
(read supported by current software) devices that are 5 volt tolerant
have a power on current surge that makes it hard to use in a low power
design without extra circuitry. So I ended up using an Altera ACEX
(EP1K) device which is only about 3-4 years old. Otherwise their newer
chips are mostly similar.

.. Perhaps the new Virtex-4 that Peter A. is dying to tell us about also
solves the 5V i/o issues ;)


I can assure you that it does not. The problem is twofold, 1) with the
thinner oxides that are being used, it gets harder and harder to provide
5 volt tolerance without adding processing steps which drives up the
cost and 2) 5 volt tolerance is becomming less and less important as
various standards evolve away from the use of 5 volt interfaces.

It has been explained to me several times that in the FPGA world, they
had two choices, retain 5 volt tolerance or compete effectively in the
high dollar, most current technology markets.

You may have missed my smiley ? ;)
Ah, yes I did!! :)

--

Rick "rickman" Collins

rick.collins@XYarius.com
Ignore the reply address. To email me use the above address with the XY
removed.

Arius - A Signal Processing Solutions Company
Specializing in DSP and FPGA design URL http://www.arius.com
4 King Ave 301-682-7772 Voice
Frederick, MD 21701-3110 301-682-7666 FAX
 
[snip]
I expect you will find Altera and Xilinx to be pretty much equal for
most apps. The Xilinx parts seem to do a bit better in DSP or other
heavily pipelined apps. This is due to a couple of features they have
such as the SRL16 and the better adders they can make with the extra
input on their LUT in arithmetic mode. Whether this is useful to you
depends on your design requirements.

Rick "rickman" Collins
Rick,

Nice post. One thing I'd like to point out though:

You should check out the Stratix II ALM. It has very powerful
arithmetic -- you can use a 4-LUT in front of each input of the adder
when you are adding two numbers. That is more powerful than either
Stratix or Virtex2. Also, it can add 3 numbers at a time, which
reduces the depth and size of adder trees (this feature is also unique
to Stratix II.

Vaughn
 
Very interesting marketing BS.
Have you realy read the original questions and try to answer those?

Sumit, if you need DSP functions, look at FPGA's with DSP alike
architectures, if price is important (obviously, you are looking for
high volumes), try to figure out what will be to total system cost
(don't forget the configuration device!). If you want to design a uC
in your FPGA, add security, etc... in other words, make a checklist
with mins and max's and try to describe your design to the FAEs of
Actel, Altera, Lattice and Xilinx (if you want to compare them all).
If you like the idea of flash based - some devices will fall of the
checklist, if you like SRAM, some others will fall of, etc. If you
need 5V tolerance, well ... you won't select one of the newer devices
as the aren't tolerant at all.

Best regards,

Luc

On Thu, 05 Aug 2004 03:02:57 GMT, "Paul Leventis \(at home\)"
<paul.leventis@utoronto.ca> wrote:

Thanks for your reply Thomas. I guess I should ask the question in a
different way: for devices from different vendors with the same number
of gates, will I get better performance and/or cost from a Flash or a
SRAM based FPGA ? Also, I assume that the comment about usability of
Xilinx cells being low is related to routability ? Is it any better
with the Altera/Actel etc parts ?

As another poster has indicated, Flash-based devices are just SRAM FPGAs
with an integrated Flash IP block. This removes the need for a stand-alone
EEPROM/Flash chip for configuration, and can provide a higher bandwidth
Flash-to-SRAM connection enabling faster configuration times, giving a
"instant-on" capability.

The downside of Flash is that you are stuck on a Flash process. Flash
processes are behind standard CMOS processes -- I think I've seen 0.13u
Flash talked about somewhere in EETimes, but that's about the best you get
these days, and its immature.

We've opted to include an on-die Flash memory in our Max II family of CPLDs.
These devices can't really take advantage of cutting-edge process technology
due to pad limitation and voltage/power requirements of the target market,
so the process "penalty" isn't an issue. And CPLD users want a simple,
one-chip solution and instant-on capabilities.

To first order, chips manufactured in smaller process geometries are
faster -- our 90 nm Stratix II family is ~50% faster than our 130 nm Stratix
family. However, comparing two chips with different architecture (Stratix
vs. Virtex II, Cyclone vs. Spartan 3) by using process technology is not
going to necessarily give the right answer. For example, we find that
Cyclone is significantly faster than Spartan-3, despite being manufactured
on 130 vs. 90 nm. This can be due to numerous reasons -- power vs. speed
trade-offs, software quality, architectural advantages, etc. The bottom
line is you have to try out your design on the chips in question (via the
software) to really know.


As for usability/routability, Altera's FPGAs are designed to be routable at
100% utilization (both LUTs and registers) for all but the hairiest of
designs. I don't have any first-hand knowledge of the routability of
competitors parts and thus will not comment on that.

Regards,

Paul Leventis
Altera Corp.
 
Vaughn, Peter, Others

How much faster are the 90nm parts over the 130nm parts? I saw
someone on this forum say that you can achieve almost 2x performance.
Is this because of the move from 130 to 90 or is it because of the new
architectures of Stratix-II and Spartan-3 etc ? Is the new
architecture a product of the fact that you can fit more logic at 90nm
than was possible at 130nm ?

Thanks
Sumit
 
Paul

Are your 90nm parts 2x better performance because of going to 90nm
process or because of the new/better architecture ?

Thanks
Sumit
 
Hi Sumit,

How much faster are the 90nm parts over the 130nm parts? I saw
someone on this forum say that you can achieve almost 2x performance.
Is this because of the move from 130 to 90 or is it because of the new
architectures of Stratix-II and Spartan-3 etc ? Is the new
architecture a product of the fact that you can fit more logic at 90nm
than was possible at 130nm ?
Stratix II (90 nm) offers a 50% average performance improvement over Stratix
(130 nm). In addition, some critical blocks (DSPs, memories, I/Os) were
sped up significantly. This is a combination of architecture, process
technology, and elbow grease in the electrical design. The main
architectural enhancement is the Adaptive Logic Module (ALM) which replaces
the Logic Element of Stratix. There are some additional tweaks, but I
frankly can't recall which ones are user visible. And good electrical
design can always help -- since some features from Stratix II were an
evolution from Stratix, designers could spend more time tweaking the design
rather than concentrating strictly on functional correctness.

As far as process goes, it used to be that moving from one process to a
smaller one would give automatic speed ups and a smaller die size to boot.
The trade-offs are more complex these days. The die size savings are still
there, but the speed-up is not automatic. In smaller processes, we thin the
gate oxide to improve transistor speed (~linear with gate oxide thickness).
But we must then shrink the core voltage (Vcc) to reduce Vgs otherwise the
oxide breaks down (reliability issue); the thinner oxide also causes
increased gate leakage, which is mitigated some by reduced Vgs. Reducing
Vcc also reduces dynamic power (quadratically). As we scale down Vcc we
need to scale down the threshold voltage (Vt) otherwise the transistor gets
too slow (Ids = k(W/L)(Vgs - Vt)^2). But the lower the threshold, the less
"off" the transistor is when Vgs=0V. And of course the gate length (main
process feature) is shrinking, which (linearly) increases transistor speed
but greatly increases sub-threshold leakage. So we have to pick-and-chose
when to apply fast but leaky transistors and when to stick with low-power
but slow transistors (with longer gate lengths, higher threshold voltages,
thicker gate oxides, etc.). There are many other tricks that can be
employed on the speed/power front, some of which cost area or increase
manufacturing costs, and all make our job designing the FPGA that much more
fun :)

[Disclaimer: It's 11 o'clock; hopefully I didn't garble that description!]

One other process change was the move to low-k inter-metal dielectric. This
reduces the capacitance of metal routes, in exchange for some additional
manufacturing & materials challenges. Low-K took a while for the
semiconductor industry to get right, but it's now mature enough that we feel
we can produce low-k chips with no yield impact. We've been playing with
low-k for a while but decided not to roll it out in our products until
Stratix II.

The architectural changes are somewhat independent of process, though there
is always some tweaking possible, for example as the ratio of logic vs.
routing delays change over process. Also, as power becomes more important,
many architectural choices will need to be revisted to find the right
speed/area/power/complexity trade-off. For example, the ALM offers better
power than the equivalent circuit in LEs since more logic is captured into
locally (vs. programmably) routed circuitry; this is more important at 90 nm
where power is becoming a bigger factor. So while there is some connection
to process, most architectural improvements are just the result of us having
had another two years to think!

Regards,

Paul Leventis
Altera Corp.
 

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