C
Costas Vlachos
Guest
"DarkMatter" <DarkMatter@thebarattheendoftheuniverse.org> wrote in message
news:umtnsvk15sqpqmb8jrsciapsk41apf0eau@4ax.com...
Yes, they are... Main reason is convenience, NOT better thermal
conductivity! It's much easier and much less messy to use a pad than to have
to spread thermal paste during assembly. But I don't think they can beat
thermal paste in terms of thermal conductivity. For low/medium power devices
or when I need insulation I would use them, for high power stuff I prefer
the paste.
Costas
news:umtnsvk15sqpqmb8jrsciapsk41apf0eau@4ax.com...
On Mon, 1 Dec 2003 18:24:28 +0000 (UTC), "Costas Vlachos"
c-X-vlachos@hot-X-mail.com> Gave us:
Agreed, I don't like them either... I'd avoid using them for any serious
heatsinking work.
They ARE in use, across the industry... for "Serious heat sinking
work". Doh!
Yes, they are... Main reason is convenience, NOT better thermal
conductivity! It's much easier and much less messy to use a pad than to have
to spread thermal paste during assembly. But I don't think they can beat
thermal paste in terms of thermal conductivity. For low/medium power devices
or when I need insulation I would use them, for high power stuff I prefer
the paste.
Costas