N
N_Cook
Guest
Owner says working , then stored indoors for a few months while at uni
and now although bar graph functions etc, no sound in the speakers. I
tried it and the same.
In the bottom of the case a piece of PPE, sheared off in one piece but
not the whole encapsulation, from one of the mains SMPS 6 pin combined
controller and powerFET devices.
A TOP249YN. As that side powers main +rail of the PAs and the unit does
not go into protect, I'm assuming that and the other TOP249Y are in
working order and some short-term stress blew off the PPE sometime back
in its working history. Under x30 you can see a striated part of the die
and no sign of burning or sputtering anywhere on either part. Heat with
<>110 deg C hot air, to expel humidity , then a piece of mica and then a
covering of RTV ?
or Grind back any awkward bits of the retrieved section and glue back
with RTV , only on the outside,
or use RTV on the inside , so in contact with the die (after hot-airing
that is)
Otherwise the PAs seem ok on cold DVM-D testing and at least one failed
PbF solder join found, 20 to 100 ohm, on the notorious wobbly union of
boards is probably the recent failure mechanism, the music/speech sw
seems ok
and now although bar graph functions etc, no sound in the speakers. I
tried it and the same.
In the bottom of the case a piece of PPE, sheared off in one piece but
not the whole encapsulation, from one of the mains SMPS 6 pin combined
controller and powerFET devices.
A TOP249YN. As that side powers main +rail of the PAs and the unit does
not go into protect, I'm assuming that and the other TOP249Y are in
working order and some short-term stress blew off the PPE sometime back
in its working history. Under x30 you can see a striated part of the die
and no sign of burning or sputtering anywhere on either part. Heat with
<>110 deg C hot air, to expel humidity , then a piece of mica and then a
covering of RTV ?
or Grind back any awkward bits of the retrieved section and glue back
with RTV , only on the outside,
or use RTV on the inside , so in contact with the die (after hot-airing
that is)
Otherwise the PAs seem ok on cold DVM-D testing and at least one failed
PbF solder join found, 20 to 100 ohm, on the notorious wobbly union of
boards is probably the recent failure mechanism, the music/speech sw
seems ok