WSON package prototype

[M.Joshi]

Hello,

I am trying to prototype a circuit which uses a TI LMP91000 IC. The I
is a tiny WSON package and I'm unsure how to go about making a prototyp
PCB for it.

Can standard UV photoresist and etching methods be used?

I have access to an oven for surface mount devices. Does a stencil nee
to be created to apply the solder paste? The pin/pads under the IC ar
very tiny.

The adapters I have seen to convert WSON to DIP are far too expensive


--
M.Joshi

 

[Jon Elson]

M.Joshi wrote:

Hello,

I am trying to prototype a circuit which uses a TI LMP91000 IC. The IC
is a tiny WSON package and I'm unsure how to go about making a prototype
PCB for it.

Can standard UV photoresist and etching methods be used?

Sure, they make the ICs themselves with very similar resist and processes.

I have access to an oven for surface mount devices. Does a stencil need
to be created to apply the solder paste? The pin/pads under the IC are
very tiny.

Yes, you need a stencil to get the right amount of paste in the right spots.

Expect a LOT of tests before you get anywhere near reliable soldering.
I worked with a WS package a while ago and had insane difficulty with
solder bridges under them chips. I redid the board with an SSOP-type
package and that worked vastly better.

Jon