Using backside power in chips gives several percent improvement in speed , die size and power consumption...

J

Jan Panteltje

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Intel Details PowerVia Backside Power Delivery Technology
https://www.tomshardware.com/news/intel-details-powervia-backside-power-delivery-network
A key feature of Intel\'s 18A and 20A nodes revealed

Samsung Expects Huge Chip Performance Gains From Backside Power Delivery
https://www.tomshardware.com/news/samsung-expects-huge-performance-gains-from-backside-power-delivery
Samsung shares power delivery advantages
 
On Sun, 13 Aug 2023 07:18:32 GMT, Jan Panteltje <alien@comet.invalid>
wrote:

Intel Details PowerVia Backside Power Delivery Technology
https://www.tomshardware.com/news/intel-details-powervia-backside-power-delivery-network
A key feature of Intel\'s 18A and 20A nodes revealed

Samsung Expects Huge Chip Performance Gains From Backside Power Delivery
https://www.tomshardware.com/news/samsung-expects-huge-performance-gains-from-backside-power-delivery
Samsung shares power delivery advantages

That\'s wonderful, but we\'ve been doing that on multilayer PC boards
for decades.
 
On a sunny day (Sun, 13 Aug 2023 06:46:00 -0700) it happened John Larkin
<jlarkin@highlandSNIPMEtechnology.com> wrote in
<qinhdih9b33el3pn31v4lbsflcnm1rvgao@4ax.com>:

On Sun, 13 Aug 2023 07:18:32 GMT, Jan Panteltje <alien@comet.invalid
wrote:

Intel Details PowerVia Backside Power Delivery Technology
https://www.tomshardware.com/news/intel-details-powervia-backside-power-delivery-network
A key feature of Intel\'s 18A and 20A nodes revealed

Samsung Expects Huge Chip Performance Gains From Backside Power Delivery
https://www.tomshardware.com/news/samsung-expects-huge-performance-gains-from-backside-power-delivery
Samsung shares power delivery advantages


That\'s wonderful, but we\'ve been doing that on multilayer PC boards
for decades.

Ys, I had thr same thought,
but then silly-con may be a bit more difficult...
 
On Sun, 13 Aug 2023 15:01:09 GMT, Jan Panteltje <alien@comet.invalid>
wrote:

On a sunny day (Sun, 13 Aug 2023 06:46:00 -0700) it happened John Larkin
jlarkin@highlandSNIPMEtechnology.com> wrote in
qinhdih9b33el3pn31v4lbsflcnm1rvgao@4ax.com>:

On Sun, 13 Aug 2023 07:18:32 GMT, Jan Panteltje <alien@comet.invalid
wrote:

Intel Details PowerVia Backside Power Delivery Technology
https://www.tomshardware.com/news/intel-details-powervia-backside-power-delivery-network
A key feature of Intel\'s 18A and 20A nodes revealed

Samsung Expects Huge Chip Performance Gains From Backside Power Delivery
https://www.tomshardware.com/news/samsung-expects-huge-performance-gains-from-backside-power-delivery
Samsung shares power delivery advantages


That\'s wonderful, but we\'ve been doing that on multilayer PC boards
for decades.

Ys, I had thr same thought,
but then silly-con may be a bit more difficult...

Another similarity is via resistance, or in our current case here, via
thermal resistance. I guess that via thermal resistance isn\'t an issue
in ICs.

I don\'t know if Moore or Feynman considered connection resistance as a
limiting factor on IC scaling.
 
On a sunny day (Sun, 13 Aug 2023 09:03:48 -0700) it happened John Larkin
<jlarkin@highlandSNIPMEtechnology.com> wrote in
<sfvhdidr5s0u2qs3o36n6uvifhbvspe97t@4ax.com>:

On Sun, 13 Aug 2023 15:01:09 GMT, Jan Panteltje <alien@comet.invalid
wrote:

On a sunny day (Sun, 13 Aug 2023 06:46:00 -0700) it happened John Larkin
jlarkin@highlandSNIPMEtechnology.com> wrote in
qinhdih9b33el3pn31v4lbsflcnm1rvgao@4ax.com>:

On Sun, 13 Aug 2023 07:18:32 GMT, Jan Panteltje <alien@comet.invalid
wrote:

Intel Details PowerVia Backside Power Delivery Technology
https://www.tomshardware.com/news/intel-details-powervia-backside-power-delivery-network
A key feature of Intel\'s 18A and 20A nodes revealed

Samsung Expects Huge Chip Performance Gains From Backside Power Delivery
https://www.tomshardware.com/news/samsung-expects-huge-performance-gains-from-backside-power-delivery
Samsung shares power delivery advantages


That\'s wonderful, but we\'ve been doing that on multilayer PC boards
for decades.

Ys, I had thr same thought,
but then silly-con may be a bit more difficult...

Another similarity is via resistance, or in our current case here, via
thermal resistance. I guess that via thermal resistance isn\'t an issue
in ICs.

I don\'t know if Moore or Feynman considered connection resistance as a
limiting factor on IC scaling.

It is very basic thing, as old as the world:
Power:
https://panteltje.nl/pub/z80/graphics_card_bottom.jpg
Signal:
https://panteltje.nl/pub/z80/graphics_card_top.jpg

:)
 

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