Transistor case.

On Mon, 25 Oct 2004 18:00:51 -0500, "Brian" <brian@w3gate.com> wrote:

It looks like a TO-3, but maybe 50% larger. What is it?
Click to expand...
Perhaps your thinking is reversed? TO-66 looks like a _size-reduced_
TO-3.

...Jim Thompson
--
| James E.Thompson, P.E. | mens |
| Analog Innovations, Inc. | et |
| Analog/Mixed-Signal ASIC's and Discrete Systems | manus |
| Phoenix, Arizona Voice:(480)460-2350 | |
| E-mail Address at Website Fax:(480)460-2142 | Brass Rat |
| http://www.analog-innovations.com | 1962 |

I love to cook with wine. Sometimes I even put it in the food.
 
On Mon, 25 Oct 2004 18:00:51 -0500, "Brian" <brian@w3gate.com> wrote:

It looks like a TO-3, but maybe 50% larger. What is it?
Click to expand...
There are oversized TO-5 and TO-39 packages which are TO8.

Oversized TO-3 is an "X-87", first associated with Toshiba products
since the late '70s.(46mm or 43.3 mm between mounting holes vs the
standard 30mm depending on mfr)

Usually when the TO-3 is 'improved', the solution involves taking the
lead-outs through the lid, or sidewalls without signifigantly
increasing the mounting imprint. This allows for a larger wafer
bonding area.

The altered packages are usually associated with parts that have
current ratings in excess of 30A or power ratings above 300W, and may
be most often seen in rarer types of thyristors, bridges and static
induction devices from SE Asia. (Tokin Sanyo)

The function is more easily/economically performed by other packages,
though hermetic parts will be ceramic rather than metal-bonded.

Any part number or mfr logo?

RL
 
This may sound odd, but I am looking for the cover for one to complete a
restoration. Probably going to be a hell of a hunt.

"legg" <legg@nospam.magma.ca> wrote in message
news:7tgrn091n0j8ae35utigqug7imt5f3ugm1@4ax.com...
On Mon, 25 Oct 2004 18:00:51 -0500, "Brian" <brian@w3gate.com> wrote:

It looks like a TO-3, but maybe 50% larger. What is it?


There are oversized TO-5 and TO-39 packages which are TO8.

Oversized TO-3 is an "X-87", first associated with Toshiba products
since the late '70s.(46mm or 43.3 mm between mounting holes vs the
standard 30mm depending on mfr)

Usually when the TO-3 is 'improved', the solution involves taking the
lead-outs through the lid, or sidewalls without signifigantly
increasing the mounting imprint. This allows for a larger wafer
bonding area.

The altered packages are usually associated with parts that have
current ratings in excess of 30A or power ratings above 300W, and may
be most often seen in rarer types of thyristors, bridges and static
induction devices from SE Asia. (Tokin Sanyo)

The function is more easily/economically performed by other packages,
though hermetic parts will be ceramic rather than metal-bonded.

Any part number or mfr logo?

RL
Click to expand...
 
On Wed, 27 Oct 2004 03:21:44 -0500, "Brian" <brian@w3gate.com> wrote:

this cap was just the cover over the device, not part of the device itself,
similar to the ones over TO-3 devices that Keystone makes. Just to protect
it or as a heat sink.
Click to expand...
A strange combination of technologies, then.

Any cover with mounting holes in the same position could be fixed with
appropriate non-conductive standoffs.

I believe the aim is to protect the end user, and prevent component
fault due to accidental contact with the live case. Required as a
result of incompetent mechanical design, though this could result also
in misguided attempts at enhanced heatsinking.

I'm increasingly curious. What is the equipment and who was the
bodger?

RL
 
My guess is it is to protct the user from heat off of the device or protect
the device from a bump as it sticks out the back.

"legg" <legg@nospam.magma.ca> wrote in message
news:npqun0dec0ar1on806j78kbmm9t3l9ri0l@4ax.com...
On Wed, 27 Oct 2004 03:21:44 -0500, "Brian" <brian@w3gate.com> wrote:

this cap was just the cover over the device, not part of the device
itself,
similar to the ones over TO-3 devices that Keystone makes. Just to protect
it or as a heat sink.


A strange combination of technologies, then.

Any cover with mounting holes in the same position could be fixed with
appropriate non-conductive standoffs.

I believe the aim is to protect the end user, and prevent component
fault due to accidental contact with the live case. Required as a
result of incompetent mechanical design, though this could result also
in misguided attempts at enhanced heatsinking.

I'm increasingly curious. What is the equipment and who was the
bodger?

RL
Click to expand...
 
this cap was just the cover over the device, not part of the device itself,
similar to the ones over TO-3 devices that Keystone makes. Just to protect
it or as a heat sink.

"legg" <legg@nospam.magma.ca> wrote in message
news:j7qtn0pmf2i6ku0i6hp43rv5j1i6kg76j0@4ax.com...
On Tue, 26 Oct 2004 12:27:26 -0500, "Brian" <brian@w3gate.com> wrote:

This may sound odd, but I am looking for the cover for one to complete a
restoration. Probably going to be a hell of a hunt.

Is this for cosmetic purposes, or do you expect near-full function
from the restoration? Unless the part has been passivated or otherwise
sealed in some way, it's likely to be compromised by ingress of
contaminants.

These parts, being difficult to obtain, are more likely to be decapped
for inspection only AFTER they go boom, unless accessed by gremlins.

Missing cap means no ID - check the wafer under an inspection
microscope to look for vendor marks - or sketch/photograph it. It's
often possible to identify function/mfr by pattern, if it isn't sealed
with an opaque material. Evidence of a kaboom or any slip of the
decapping tools would also likely visible.

Otherwise, a sketch of the immediate interconnectons and connected
devices (schematic), or top assembly/model type number could give a
fair idea of device type and origin.

The cap's seams were likely impedance welded, at least for the steel
and copper varieties - rather difficult to remove without damage to
both parts. Reclaiming one half for recapping would be tricky, if you
had the equipment.

Cleaning, baking, testing and sealing, before any cosmetic
restoration, might be advised, depending on your aims.

RL

It looks like a TO-3, but maybe 50% larger. What is it?


There are oversized TO-5 and TO-39 packages which are TO8.

Oversized TO-3 is an "X-87", first associated with Toshiba products
since the late '70s.(46mm or 43.3 mm between mounting holes vs the
standard 30mm depending on mfr)

Usually when the TO-3 is 'improved', the solution involves taking the
lead-outs through the lid, or sidewalls without signifigantly
increasing the mounting imprint. This allows for a larger wafer
bonding area.

The altered packages are usually associated with parts that have
current ratings in excess of 30A or power ratings above 300W, and may
be most often seen in rarer types of thyristors, bridges and static
induction devices from SE Asia. (Tokin Sanyo)

The function is more easily/economically performed by other packages,
though hermetic parts will be ceramic rather than metal-bonded.

Any part number or mfr logo?

RL
Click to expand...
 
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