Timing Analyzer - delay to die pad or package pin?

[Allan Herriman]

Hi,

I have a question about the Xilinx Timing Analyzer (trce).

Does it report the I/O timing at the die pad or the package pin /
ball?

I believe the 5.x and earlier versions of the software referred timing
to the die pads, whereas 6.x seems to be taking the flight delay of
the package into account.
Could someone from Xilinx please confirm whether this is the case?

Thanks,
Allan

 

[Allan Herriman]

On Fri, 28 Nov 2003 17:47:46 +1100, Allan Herriman
<allan.herriman.hates.spam@ctam.com.au.invalid> wrote:

Hi,

I have a question about the Xilinx Timing Analyzer (trce).

Does it report the I/O timing at the die pad or the package pin /
ball?

I believe the 5.x and earlier versions of the software referred timing
to the die pads, whereas 6.x seems to be taking the flight delay of
the package into account.
Could someone from Xilinx please confirm whether this is the case?

My local FAE explained that the 6.x software includes the package
flight time in the Tiopick and Tiockp parameters *for flip chip
packages*, i.e. the timing is referred to the ball rather than the die
pad.

The 5.x software does not include the flight time, i.e. the timing is
referred to the die pad rather than the ball.

Regards,
Allan.