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TGA8014 datasheet and PDF
http://www.chinaicmart.com/series-TGA/TGA8014.html
TGA8014 Description
The TriQuint TGA8014-SCC is a two-stage GaAs monolithic medium power
amplifier. Reactively matched 914 um and 1219 um FETS provide 11 dB
nominal gain with 16 percent typical power-added efficiency and output
power at 1 dB gain compression of 0.5 watt. Ground is provided to the
circuitry through vias to the backside metallization.
The small size and inherent reliability advantages of a monolithic
device over a hybrid design make this device attractive for use in a
variety of military applications. Used in a balanced configuration,
the TGA8014-SCC effectively addresses applications such as driver and
power stages in EW amplifiers, local oscillator buffers, and TWT
replacement amplifiers.
Bond pad and backside metallization is gold plated for compatibility
with eutectic alloy attachment methods as well as the thermcompression
and thermosonic wirebonding processes. The TGA8014-SCC is supplied in
chip form and is readily assembled using automated equipment.
to share our product technology information
TGA8014 datasheet and PDF
http://www.chinaicmart.com/series-TGA/TGA8014.html
TGA8014 Description
The TriQuint TGA8014-SCC is a two-stage GaAs monolithic medium power
amplifier. Reactively matched 914 um and 1219 um FETS provide 11 dB
nominal gain with 16 percent typical power-added efficiency and output
power at 1 dB gain compression of 0.5 watt. Ground is provided to the
circuitry through vias to the backside metallization.
The small size and inherent reliability advantages of a monolithic
device over a hybrid design make this device attractive for use in a
variety of military applications. Used in a balanced configuration,
the TGA8014-SCC effectively addresses applications such as driver and
power stages in EW amplifiers, local oscillator buffers, and TWT
replacement amplifiers.
Bond pad and backside metallization is gold plated for compatibility
with eutectic alloy attachment methods as well as the thermcompression
and thermosonic wirebonding processes. The TGA8014-SCC is supplied in
chip form and is readily assembled using automated equipment.