Guest
POLYTEDA Software Corporation
http://www.polyteda.com
July 12, 2006. Press Release.
Toronto, ON, Canada - POLYTEDA Software Corporation introduced
Initial Strategic
Partnership Program (ISPP). The main target of the program is a
creating partnership
between semiconductor manufacturers and the company as
System-in-Package (SiP)
EDA tool vendor for developing effective solution for complex
multi-physics problems
that SiP designers are facing in their everyday practice.
System-in-Package (SiP) is a relatively new manufacturing technology
that is still in its
developing stage. There are no industry-wide standards yet. Vast
varieties of
technological processes, design flows, and testing procedures exist
among
semiconductor manufacturers. It creates a huge problem for EDA vendors:
the software
tools have to cover all this diversity. Even in other, more traditional
electronic design
areas, EDA companies are spending enormous effort to support ranges of
similar
software products because of differences in design flow. In case of
SiP, the complexity
of multi-physic processes is multiplying the varieties of design flow
and creates almost
unlimited heterogeneity.
For full text in PDF format click here:
http://www.polyteda.ca/polyteda/press_releases/POLYTEDA_PressRelease_20060712.pdf
http://www.polyteda.com
July 12, 2006. Press Release.
Toronto, ON, Canada - POLYTEDA Software Corporation introduced
Initial Strategic
Partnership Program (ISPP). The main target of the program is a
creating partnership
between semiconductor manufacturers and the company as
System-in-Package (SiP)
EDA tool vendor for developing effective solution for complex
multi-physics problems
that SiP designers are facing in their everyday practice.
System-in-Package (SiP) is a relatively new manufacturing technology
that is still in its
developing stage. There are no industry-wide standards yet. Vast
varieties of
technological processes, design flows, and testing procedures exist
among
semiconductor manufacturers. It creates a huge problem for EDA vendors:
the software
tools have to cover all this diversity. Even in other, more traditional
electronic design
areas, EDA companies are spending enormous effort to support ranges of
similar
software products because of differences in design flow. In case of
SiP, the complexity
of multi-physic processes is multiplying the varieties of design flow
and creates almost
unlimited heterogeneity.
For full text in PDF format click here:
http://www.polyteda.ca/polyteda/press_releases/POLYTEDA_PressRelease_20060712.pdf