Soldering TQFSOPNCD packages ;-)

[Rich Grise]

Is this how you're supposed to R&R them microchip thingies?
http://www.neodruid.com/images/dscf0150.jpg
;-)

Cheers!
Rich

 

[Winfield Hill]

Rich Grise wrote...

Is this how you're supposed to R&R them microchip thingies?

Not with that big iron!

http://www.neodruid.com/images/dscf0150.jpg

Ah, the famous Davicom 48-pin dm9161 10base-T 100base-T physical-
layer IC. http://www.davicom.com.tw/eng/products/dm9161.htm


--
Thanks,
- Win

 

[DaveC]

Winfield Hill <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
news:cuffsk0e43@drn.newsguy.com:

http://www.neodruid.com/images/dscf0150.jpg

I've never seen such a shiny electrolytic before.

DaveC

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[John Woodgate]

I read in sci.electronics.design that Rich Grise <richgrise@example.net>
wrote (in <pan.2005.02.10.10.16.57.99342@example.net&gt about 'Soldering
TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:

Is this how you're supposed to R&R them microchip thingies?
http://www.neodruid.com/images/dscf0150.jpg
;-)

No, you need a bit big enough to go over the package and solder all the

lead-outs at once.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk

 

[John Woodgate]

I read in sci.electronics.design that Boris Mohar <borism_-void-
_@sympatico.ca> wrote (in <fkkm01l76unjc731jg2c6p76uflbfsb029@4ax.com&gt
about 'Soldering TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:

Of course you need a10x- 30x stereo microscope
with zoom.

You also need a daughter.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk

 

[Rene Tschaggelar]

Boris Mohar wrote:

Of course you need a10x- 30x stereo microscope with zoom.

A pair of 4 dioptries glasses are suffiecient

Rene
--
Ing.Buero R.Tschaggelar - http://www.ibrtses.com
& commercial newsgroups - http://www.talkto.net

 

[Boris Mohar]

On Thu, 10 Feb 2005 12:48:15 +0000, John Woodgate
<jmw@jmwa.demon.contraspam.yuk> wrote:

I read in sci.electronics.design that Boris Mohar <borism_-void-
_@sympatico.ca> wrote (in <fkkm01l76unjc731jg2c6p76uflbfsb029@4ax.com&gt
about 'Soldering TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:
Of course you need a10x- 30x stereo microscope
with zoom.

You also need a daughter.

Of course. A well paid daughter.

--

Boris Mohar

 

[Leon Heller]

"Winfield Hill" <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
message news:cuffsk0e43@drn.newsguy.com...

Rich Grise wrote...

Is this how you're supposed to R&R them microchip thingies?

Not with that big iron!

Perhaps he's drag soldering, a large tip works better for that than a small
one. It does look too big even for that, though.

Leon

 

Is this how you're supposed to R&R them microchip thingies?
http://www.neodruid.com/images/dscf0150.jpg

I think he's heating the lead close to the package and applying the
solder down at the PCB land. Eventually the lead gets hot enough to
melt the solder and it wets the land. You don't need a particularly
fine iron to do this. In fact the shape he's hand-carved in that tip is
much the same shape I prefer: very pointy, steep angle on the tip. Long
thin tips don't transfer heat well enough.

 

[John Larkin]

On Thu, 10 Feb 2005 15:27:26 -0000, "Leon Heller"
<leon_heller@hotmail.com> wrote:

"Winfield Hill" <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
message news:cuffsk0e43@drn.newsguy.com...
Rich Grise wrote...

Is this how you're supposed to R&R them microchip thingies?

Not with that big iron!


Perhaps he's drag soldering,

or trolling.

John

 

[Rob Gaddi]

Now tell me how to hand solder this:
http://focus.ti.com/lit/ml/mxbg003a/mxbg003a.pdf
Dimensions are in mm.

Link to TI packaging info http://focus.ti.com/general/docs/packaging.jsp

Heat gun and prayer.

Speaking of which, has anyone found a good way of dealing with those
thermally enhanced packages where they sink the lead frame to a pad
underneath the chip? I'm using the aforementioned heat gun + prayer
technique, combined with preheating the board until the solder paste is
just starting to melt, then throwing the chip on, but I'm still getting
a somewhat unacceptable casualty rate.

 

[Rich Grise]

On Thu, 10 Feb 2005 08:07:44 -0800, larwe wrote:

Is this how you're supposed to R&R them microchip thingies?
http://www.neodruid.com/images/dscf0150.jpg

I think he's heating the lead close to the package and applying the
solder down at the PCB land. Eventually the lead gets hot enough to
melt the solder and it wets the land. You don't need a particularly
fine iron to do this. In fact the shape he's hand-carved in that tip is
much the same shape I prefer: very pointy, steep angle on the tip. Long
thin tips don't transfer heat well enough.

Yikes! Actually, it was supposed to be a joke. I wouldn't try to solder
anything that small in the first place, and I certainly wouldn't use that
iron!

I have a RS "princess" or something that I'd use for smaller work anyway.


Thanks!
Rich

 

[Michael A. Terrell]

Rene Tschaggelar wrote:

A pair of 4 dioptries glasses are suffiecient

Rene

Maybe, depending on your vision.

--
Beware of those who suffer from delusions of adequacy!

Michael A. Terrell
Central Florida

 

[Paul Burke]

Rob Gaddi wrote:

Speaking of which, has anyone found a good way of dealing with those
thermally enhanced packages where they sink the lead frame to a pad
underneath the chip?

By hand I assume..

Put a PTH in the underside pad, make it just big enough to get a fine
iron tip through. Solder the outside pins as normal (tag down the
corners, little bit of solder on tip, draw across pins- finicky with
little short pins but works) then flood the underside from underneath.

Paul Burke