A
alb
Guest
Hi all,
I'm not sure this is the good place where to post this, please advise a
better NG in case it exists.
I'm working on the soldering process of a component with phosphor bronze
pins onto a fairly standard FR-4 multilayer PCB. The component is a
light detector (MPPC: Multi Pixel Photon Counter) and I still do not
know what is the amount of heat to deal with.
Is there any recommendation on soldering this components on a pre-tinned
pad?
Anything special on thermal behavior which should be considered? For
instance I have seen a power mosfet mounted without stress release on
the soldering point on a the thru-hole one-sided pad that after several
ON/OFF cycles caused the joint to crack.
Any hint is appreciated.
Al
--
A: Because it fouls the order in which people normally read text.
Q: Why is top-posting such a bad thing?
A: Top-posting.
Q: What is the most annoying thing on usenet and in e-mail?
I'm not sure this is the good place where to post this, please advise a
better NG in case it exists.
I'm working on the soldering process of a component with phosphor bronze
pins onto a fairly standard FR-4 multilayer PCB. The component is a
light detector (MPPC: Multi Pixel Photon Counter) and I still do not
know what is the amount of heat to deal with.
Is there any recommendation on soldering this components on a pre-tinned
pad?
Anything special on thermal behavior which should be considered? For
instance I have seen a power mosfet mounted without stress release on
the soldering point on a the thru-hole one-sided pad that after several
ON/OFF cycles caused the joint to crack.
Any hint is appreciated.
Al
--
A: Because it fouls the order in which people normally read text.
Q: Why is top-posting such a bad thing?
A: Top-posting.
Q: What is the most annoying thing on usenet and in e-mail?