soldering hazard

[Wong]

Just curious and I would like to ask for ur opinions.

Is this OK for someone solder a SMD TQFP IC like this:

1.) First, solder one side(there are 4 sides) with all pins on that
side shorted. So the pins are soldered on the pad of the PCB.

2.) Then by using a clean soldering iron tip (the shape like a knife),
to pull the excessive soldering flux out. Keep repeating this step
until the pins are look separated.

3.) Now, one side of pins are soldered.

4.) Repeat the above steps for the other 3 sides.

So would this OK for an IC by shorted all and apply heat to the pins
at the same time ?

 

[Michael A. Terrell]

Wong wrote:

Just curious and I would like to ask for ur opinions.

Is this OK for someone solder a SMD TQFP IC like this:

1.) First, solder one side(there are 4 sides) with all pins on that
side shorted. So the pins are soldered on the pad of the PCB.

2.) Then by using a clean soldering iron tip (the shape like a knife),
to pull the excessive soldering flux out. Keep repeating this step
until the pins are look separated.

3.) Now, one side of pins are soldered.

4.) Repeat the above steps for the other 3 sides.

So would this OK for an IC by shorted all and apply heat to the pins
at the same time ?

Sounds like a good way to destroy the chip, the pads, or both. You
should solder two opposing corners, check the alignment of the other
pins, then carefully solder them one at a time.
--
20 days!


Michael A. Terrell
Central Florida