Power cycling test setup for chip package

[Rallyjo]

I have an electronic package that needs to be power cycled. Therefore,
I am planning to stick foil heaters on its surface to generate heat
(as if the chip was ON). A T-type thermocouple will also be mounted on
the chip surface. The heater has a resistance of 5.3ohms. I want the
chip surface to reach 100C. What voltage will be required to achieve
this temp? Also what should be the ON time and OFF time for the cycle.
And how can this be monitored and controlled?

Any inputs in this regard are welcome.

-Ral

 

[R.Legg]

rvjoshi02@yahoo.com (Rallyjo) wrote in message news:<a3407720.0403201746.43dead65@posting.google.com>...

I have an electronic package that needs to be power cycled. Therefore,
I am planning to stick foil heaters on its surface to generate heat
(as if the chip was ON). A T-type thermocouple will also be mounted on
the chip surface. The heater has a resistance of 5.3ohms. I want the
chip surface to reach 100C. What voltage will be required to achieve
this temp? Also what should be the ON time and OFF time for the cycle.
And how can this be monitored and controlled?

Valid power cycling will generally involve the device functioning.
Applying external heat is not a substitute. External ambient is just
that - a controlled external air temperature. Device temperatures are
monitored only to determine that specified limits are not exceeded
under expected operating conditions.

Refer to recommended burn-in configurations for the device, if you
don't have an expected standard performance and ambient temperature
characterized for this device, in it's application.

The control of ambient temperature should be peformed by conventional
means, over the range specified for the device. Thermal cycling is
another test that may or may not involve power cycling, depending on
the intended function of the tests scheduled.

RL