S
spectrallypure
Guest
Hello everybody! Sorry for this not-so-on-the-topic question...
My research group has just been granted access to the 0.18u mixed
signal Cadence design kits for both TSMC and UMC foundries, which we
plan to use in order to implement a full-custom design. But to our
surprise, there are no PAD or ESD protection cells at all in these
design kits!! I have installed and browsed the libraries provided in
these design kits and all haven't been able to find a single periphery
cell. Now I wonder if these kits provide any of these cells at all, or
if the designer has to design and layout all them manually!!! :S
Does anybody know where are these cells located/supplied?
I have noticed in the www that many people mention the use of ARM/
Artisan IO cells... is this the only resource for IO/ESD cells for the
aforementioned processes? Are there any non-commercial alternatives?
Thanks in advance for any help/ideas!
Regards,
Jorge.
P.S. By the way, other than the obvious, I also need the PAD/ESD cells
because I need to take into account the parasitic loading of these
structures in the early stages of our design.
My research group has just been granted access to the 0.18u mixed
signal Cadence design kits for both TSMC and UMC foundries, which we
plan to use in order to implement a full-custom design. But to our
surprise, there are no PAD or ESD protection cells at all in these
design kits!! I have installed and browsed the libraries provided in
these design kits and all haven't been able to find a single periphery
cell. Now I wonder if these kits provide any of these cells at all, or
if the designer has to design and layout all them manually!!! :S
Does anybody know where are these cells located/supplied?
I have noticed in the www that many people mention the use of ARM/
Artisan IO cells... is this the only resource for IO/ESD cells for the
aforementioned processes? Are there any non-commercial alternatives?
Thanks in advance for any help/ideas!
Regards,
Jorge.
P.S. By the way, other than the obvious, I also need the PAD/ESD cells
because I need to take into account the parasitic loading of these
structures in the early stages of our design.