Pack:2309 - Too many bonded comps of type

[pfaisalbe]

Hi

I am using Xilinx Sapartan 3 . I have wrote HDL in verilog for testing a
external memory attached to FPGA. Mapping end up with error.

Pack:2309 - Too many bonded comps of type "IOB" found to fit this device.


I am a beginner in this field. In the first place , It seems that I a
using more resources than the FPGA can provide ? .

Please suggest , how to get rid of this error

Thanks and Regards

Faisal



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Posted through http://www.FPGARelated.com

 

[John Miles]

On Oct 9, 5:44 am, "pfaisalbe" <pfaisalbe@n_o_s_p_a_m.gmail.com>
wrote:

Hi

I am using Xilinx Sapartan 3 . I have wrote HDL in verilog for testing an
external memory attached to FPGA. Mapping end up with error.

Pack:2309 -Toomanybondedcompsof type "IOB" found to fit this device.

I am a beginner in this field. In the first place , It seems that I am
using more resources than the FPGA can provide ? .

Please suggest ,  how to get rid of this error

Thanks and Regards

Faisal

---------------------------------------        
Posted throughhttp://www.FPGARelated.com

This just started happening to an existing design that I migrated from
ISE 11.5 to 12.3. No idea why, as the floorplan is nowhere near
full. You might try building your project under ISE 11.

-- john, KE5FX