Guest
Any generic term for this/reasearch? 40 degree C/70 degree F, higher
than traditional leaded solder temperatures, so otherwise like-for-
like, more chance of excessive heat damage. Ignoring problems that
emerge at component sampling/testing at manufacture (tin tinning of
pins ) and post board soldering testing stage/ final product
than traditional leaded solder temperatures, so otherwise like-for-
like, more chance of excessive heat damage. Ignoring problems that
emerge at component sampling/testing at manufacture (tin tinning of
pins ) and post board soldering testing stage/ final product