J
Jamie Morken
Guest
Hi all,
I am using a 64 pin mlf package (atmega128) and it has a large square
pad on the bottom of the package that is hooked up to the ground pins
electrically. I didn't know that this package has a large ground pad
when I designed the board so there are some vias under the package that
are different signals. To avoid electrical contact with these vias and
the ground pad would it be best to use some lacquer to insulate the
ground pad before soldering? I think it would be ok to do this but am
not sure if this pad needs to be hooked up electrically to the board.
cheers,
Jamie
I am using a 64 pin mlf package (atmega128) and it has a large square
pad on the bottom of the package that is hooked up to the ground pins
electrically. I didn't know that this package has a large ground pad
when I designed the board so there are some vias under the package that
are different signals. To avoid electrical contact with these vias and
the ground pad would it be best to use some lacquer to insulate the
ground pad before soldering? I think it would be ok to do this but am
not sure if this pad needs to be hooked up electrically to the board.
cheers,
Jamie