How do you solder this?

D

David Eather

Guest
I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a VSSOP
with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC? I
do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for power
etc - but the kicker is it is also in a VSSOP package.

TIA
 
"David Eather" <eather@tpg.com.au> writes:
Does anyone have some tips on how to hand solder this flyspec of an
IC? I do SOIC, SOT23 and 0805 easily but this thing beats me.
Click to expand...

Some tips...

When you design your footprint, extend the pads 1-2mm further out, so
you can access them with your iron, especially to drag excess solder
away from the chip.

To solder, pre-solder two diagonally opposite pads, place the chip,
reheat one pad with your iron. Verify the position. Reheat the other
pad. Verify position again. Now use a bigger tip to blob-solder the
rest of the pins, and desolder braid to remove the excess.

If you have an alternate way of holding the chip in the right spot, you
can skip the first few steps and just blob-solder the pins.

Also, a flux pen is your friend :)

Flux pen plus desolder braid fixes any solder bridges you make.
 
On Sun, 18 May 2014 16:29:57 -0400, DJ Delorie wrote:

"David Eather" <eather@tpg.com.au> writes:
Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

Some tips...

When you design your footprint, extend the pads 1-2mm further out, so
you can access them with your iron, especially to drag excess solder
away from the chip.

To solder, pre-solder two diagonally opposite pads, place the chip,
reheat one pad with your iron. Verify the position. Reheat the other
pad. Verify position again. Now use a bigger tip to blob-solder the
rest of the pins, and desolder braid to remove the excess.

If you have an alternate way of holding the chip in the right spot, you
can skip the first few steps and just blob-solder the pins.

Also, a flux pen is your friend :)

Flux pen plus desolder braid fixes any solder bridges you make.
Click to expand...

What DJ said.

I thought it was going to be something hard!

--

Tim Wescott
Wescott Design Services
http://www.wescottdesign.com
 
On Sunday, May 18, 2014 9:14:15 PM UTC-4, Tim Wescott wrote:
On Sun, 18 May 2014 16:29:57 -0400, DJ Delorie wrote:



"David Eather" <eather@tpg.com.au> writes:

Does anyone have some tips on how to hand solder this flyspec of an IC?

I do SOIC, SOT23 and 0805 easily but this thing beats me.



Some tips...



When you design your footprint, extend the pads 1-2mm further out, so

you can access them with your iron, especially to drag excess solder

away from the chip.



To solder, pre-solder two diagonally opposite pads, place the chip,

reheat one pad with your iron. Verify the position. Reheat the other

pad. Verify position again. Now use a bigger tip to blob-solder the

rest of the pins, and desolder braid to remove the excess.



If you have an alternate way of holding the chip in the right spot, you

can skip the first few steps and just blob-solder the pins.



Also, a flux pen is your friend :)



Flux pen plus desolder braid fixes any solder bridges you make.


What DJ said.

I thought it was going to be something hard!
Click to expand...
OK, well that only works if he has a pcb.
If he has no pcb then get a little "surfboard"
(try googling pcb and surfboard.)

George H.

--



Tim Wescott

Wescott Design Services

http://www.wescottdesign.com
Click to expand...
 
On Monday, May 19, 2014 12:01:30 PM UTC-4, John Larkin wrote:
On Mon, 19 May 2014 06:43:12 -0700 (PDT), George Herold <gherold@teachspin.com

wrote:

What DJ said.

I thought it was going to be something hard!
OK, well that only works if he has a pcb.
If he has no pcb then get a little "surfboard"

(try googling pcb and surfboard.)

George H.



--

Tim Wescott


Wescott Design Services

http://www.wescottdesign.com



These are good:

http://www.beldynsys.com/
Click to expand...
Those do look nice,
http://www.beldynsys.com/1643.pdf
Hmm, a bit spendy. You can get a few pcb's for that,
but still you sometimes want to try something today!
(and not wait for a pcb.)

George H.
--



John Larkin Highland Technology Inc

www.highlandtechnology.com jlarkin at highlandtechnology dot com



Precision electronic instrumentation
Click to expand...
 
On Mon, 19 May 2014 06:43:12 -0700 (PDT), George Herold <gherold@teachspin.com>
wrote:

On Sunday, May 18, 2014 9:14:15 PM UTC-4, Tim Wescott wrote:
On Sun, 18 May 2014 16:29:57 -0400, DJ Delorie wrote:



"David Eather" <eather@tpg.com.au> writes:

Does anyone have some tips on how to hand solder this flyspec of an IC?

I do SOIC, SOT23 and 0805 easily but this thing beats me.



Some tips...



When you design your footprint, extend the pads 1-2mm further out, so

you can access them with your iron, especially to drag excess solder

away from the chip.



To solder, pre-solder two diagonally opposite pads, place the chip,

reheat one pad with your iron. Verify the position. Reheat the other

pad. Verify position again. Now use a bigger tip to blob-solder the

rest of the pins, and desolder braid to remove the excess.



If you have an alternate way of holding the chip in the right spot, you

can skip the first few steps and just blob-solder the pins.



Also, a flux pen is your friend :)



Flux pen plus desolder braid fixes any solder bridges you make.


What DJ said.

I thought it was going to be something hard!
OK, well that only works if he has a pcb.
If he has no pcb then get a little "surfboard"
(try googling pcb and surfboard.)

George H.

--



Tim Wescott

Wescott Design Services

http://www.wescottdesign.com
Click to expand...

These are good:

http://www.beldynsys.com/



--

John Larkin Highland Technology Inc
www.highlandtechnology.com jlarkin at highlandtechnology dot com

Precision electronic instrumentation
 
On Mon, 19 May 2014 12:23:17 -0700 (PDT), George Herold
<gherold@teachspin.com> wrote:

On Monday, May 19, 2014 12:01:30 PM UTC-4, John Larkin wrote:
On Mon, 19 May 2014 06:43:12 -0700 (PDT), George Herold <gherold@teachspin.com

wrote:

What DJ said.

I thought it was going to be something hard!
OK, well that only works if he has a pcb.
If he has no pcb then get a little "surfboard"

(try googling pcb and surfboard.)

George H.



--

Tim Wescott


Wescott Design Services

http://www.wescottdesign.com



These are good:

http://www.beldynsys.com/

Those do look nice,
http://www.beldynsys.com/1643.pdf
Hmm, a bit spendy. You can get a few pcb's for that,
but still you sometimes want to try something today!
(and not wait for a pcb.)

George H.
Click to expand...

You get a zillion on a breakaway panel, so the per-adapter price is
excellent.


--

John Larkin Highland Technology, Inc

jlarkin att highlandtechnology dott com
http://www.highlandtechnology.com
 
David Eather wrote:

I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a VSSOP
with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC? I
do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for power
etc - but the kicker is it is also in a VSSOP package.

TIA
Click to expand...

Hi
If you have a solder paste syringe, run a light rope down each row. Bake it
in a toaster oven until you see proper looking flow/joints. (or use hot air
tools if you have them) You don't have to be very precise. Clean up any
solder bridges with desoldering wick.
 
On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au> wrote:

I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA
Click to expand...

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.
 
"David Eather" <eather@tpg.com.au> writes:
Using de-solder braid failed dismally at removing solder bridges. The
gap between pins is something less than 12 mills, braid won't even
touch it.
Click to expand...

I've used braid on 0.4mm pitch. Just flux the solder and put the braid
over the whole row of pins, it sucks up the extra but leaves the little
bit under the pins.
 
On Wed, 21 May 2014 08:18:35 +1000, "David Eather"
<eather@tpg.com.au> wrote:

On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au> wrote:


I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.
Click to expand...

---
Then you're either using braid that's too coarse, not enough flux,
or an iron that's too cold.

Done properly, braid _always_ wins. Period.
 
On Tue, 20 May 2014 19:03:33 -0500, John Fields
<jfields@austininstruments.com> wrote:

On Wed, 21 May 2014 08:18:35 +1000, "David Eather"
eather@tpg.com.au> wrote:

On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au> wrote:


I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.

---
Then you're either using braid that's too coarse, not enough flux,
or an iron that's too cold.
Click to expand...

---
Or braid that's loaded.
---

>Done properly, braid _always_ wins. Period.

---
John Fields
 
On Wed, 21 May 2014 08:18:35 +1000, "David Eather" <eather@tpg.com.au>
wrote:

On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au> wrote:


I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.
Click to expand...

As DJ says, you absolutely must use extra flux to get the wick to pick
up the small bridges. Radio Shack carries some pretty good paste flux
(really more gel-like) and a decent flux pen. You don't need to goop
it on but it really does make a big difference.
 
On Wed, 21 May 2014 10:39:10 +1000, Rich Webb <webb.ra@example.net> wrote:

On Wed, 21 May 2014 08:18:35 +1000, "David Eather" <eather@tpg.com.au
wrote:

On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au
wrote:


I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent
current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.

As DJ says, you absolutely must use extra flux to get the wick to pick
up the small bridges. Radio Shack carries some pretty good paste flux
(really more gel-like) and a decent flux pen. You don't need to goop
it on but it really does make a big difference.
Click to expand...

Please I use lots of flux (RMA). The solder braid is GOOT - any better -
suggestion? Temp I'll have to check
 
On Wed, 21 May 2014 10:53:55 +1000, "David Eather" <eather@tpg.com.au>
wrote:

On Wed, 21 May 2014 10:39:10 +1000, Rich Webb <webb.ra@example.net> wrote:

On Wed, 21 May 2014 08:18:35 +1000, "David Eather" <eather@tpg.com.au
wrote:

On Mon, 19 May 2014 05:45:53 +1000, David Eather <eather@tpg.com.au
wrote:


I found this chip:

http://www.ti.com/product/TPS60212

that will do all I need - step up 2v to 3.3v, very low quiescent
current
and a small package. Unfortunately it is far too small a package - a
VSSOP with a pin spacing of 0.5mm.

Does anyone have some tips on how to hand solder this flyspec of an IC?
I do SOIC, SOT23 and 0805 easily but this thing beats me.

I did find a similar IC from Microchip - not a nice, more hungry for
power etc - but the kicker is it is also in a VSSOP package.

TIA

Many thanks all. I still think VSSOP is a bitch (right up there with
lead-free solder). I did manage 1 from 2 onto an adapter board, but I
don't know yet if the IC survived the process. Using de-solder braid
failed dismally at removing solder bridges. The gap between pins is
something less than 12 mills, braid won't even touch it.

As DJ says, you absolutely must use extra flux to get the wick to pick
up the small bridges. Radio Shack carries some pretty good paste flux
(really more gel-like) and a decent flux pen. You don't need to goop
it on but it really does make a big difference.

Please I use lots of flux (RMA). The solder braid is GOOT - any better -
suggestion? Temp I'll have to check
Click to expand...

Hmmmm.... Interesting, Grasshopper. When I'm doing this I dab on a
little flux, come in vertically with a clean cut end of the braid into
the "ankle" of the leads, and then hit it briefly with a regular 1/16"
spade tip. There's a sizzle, a puff of smoke, and the bridge is gone.
Might you be using a really narrow tip? The thermal mass and larger
contact area of the larger tip might be making the difference.
 
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