Gold and Aluminium chip bondpads

[#NGUYEN QUANG VINH#]

Hi everyone,
As I know, Gold and Aluminium are the most commonly used materials in chip bondpads.

In the past, some manufacturers have switched from Aluminium to Gold, the main reasons were the excellent corrosion resistance and strong bonding with Gold coated wires. But now it seems that corrosion problems can be overcome by encapsulation process ( the bonding site is encapsulated with polymer resin ), and Al-Au can give quite adequate strength.

Could anyone tell me other advantages of using Gold instead of Aluminium for chip bondpads?

My company is planning to use Aluminium for our products, since it will reduce our manufacturing cost and enviromental problems.

Have a nice day,
Vinnie.

 

[Don Bruder]

In article <h5sLDmuYDHA.656@exchnews1.main.ntu.edu.sg>,
"#NGUYEN QUANG VINH#" <quangvinh@pmail.ntu.edu.sg> wrote:

Could anyone tell me other advantages of using Gold instead of Aluminium for
chip bondpads?

A <choose a unit> of gold having a lower thermal and electrical
resistance than the same <choose a unit> of aluminum might be considered
an advantage in some cases. I imagine it would depend on precisely what
was being done in/on/by a given chip as to whether that consideration
would mean anything. An MPU chip likely has different thermal/electrical
requirements than something like a simple AND gate or shift register.

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