M
Martin
Guest
I´m a stranger to this field, so please elaborate or name a reference:
there are lots o´ books out there on flip-chip technology,
but how is flipping the chip actually achieved?
Picture the following:
the chips/dice are resting face up on the adhesive thin film/tape
(the wafer is mounted on such for dicing) and are picked by a vacuum tweezer,
then what?
- Is there a second vacuum tweezer touching on the back side
of the chip while still beeing held by the first tweezer?
- Is the first tweezer equipped with a rotating head for spinning the chip 180°
and releasing it face down in order to pick it up again, only now touching
the back side?
What´s the actual scheme?
Thank you for clearing things up.
there are lots o´ books out there on flip-chip technology,
but how is flipping the chip actually achieved?
Picture the following:
the chips/dice are resting face up on the adhesive thin film/tape
(the wafer is mounted on such for dicing) and are picked by a vacuum tweezer,
then what?
- Is there a second vacuum tweezer touching on the back side
of the chip while still beeing held by the first tweezer?
- Is the first tweezer equipped with a rotating head for spinning the chip 180°
and releasing it face down in order to pick it up again, only now touching
the back side?
What´s the actual scheme?
Thank you for clearing things up.