ceramic resonators gone electrically leaky?

T

Terry Moreau

Guest
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
terminal. This is causing a full inventory re-work and even a field
recall of over 1,000 finished assemblies. Serious and expensive
problem to say the least. It's looking like water/solvent has gotten
into a good percentage of these SMD resonators. Specifically its ECS
part#ECS-SR1-4.00 . The electrical leakage appears to be affected by
dc bias voltage (increasing leakage current the longer any DC bias
voltage is applied for, while the leakage reduces almost to nothing if
the DC bias is removed and the part is let to stand for several
hours). Seems to me to behave like a sort of electrolysis type of
conduction.

I'm aksing if anyone has any experience with this problem with anyway,
that they can share.

Best theories so far are:

1. Solder profile is too hot or for too long and ceramic SMD package
seal is compromised. Susequent water wash flux removal is letting
flux laden water into the resonators delicate internals where some
closely spaced electrode metalization path air gaps are being filled
with party conductive ionize solution. The solution evaporates and
super saturates down to a "goo" where it never completely dries out to
a non-conductive state. Compounded by the fact that the resonator is
on a board that gets conformal coated. Trapped moisture is then
sealed in!

3. The water wash cycle is too long and/or the board is not
sufficiently dried and/or gets conformal coated before it's completely
dried. The porosity of the ceramic is enough to let some moisture
into the resonator internals where it straddles electrodes and
provides an electrically leaky conduction path.

2. The solvent in the conformal coating (hexamethyldisiloxane) is
either attacking the ceramic package seal material, or is simply over
time diffusing into the partially porous ceramic package? Again,
collecting/depositing inbetween small spaced internal electrodes and
provide an electrically leaky conductive path.

The resonator is used in a typical +5V CPU oscillator circuit with
about 500K feedback resistor internal to the CPU. Leakage spec for
the part are > 100Meg ohms at 10volts, however I get anywhere from 4K
to 4Meg ohms leakage at 2.5Volts.

I never get the problem on a fresh resonator out of the tape/real
package.

The problem is showing up in about 10% of boards and it may be
anything from days to months of operation before the leakage level is
bad enough that the CPU oscillator dies.

Short term I've halted production and ordered rework of all boards to
switch to a different resonator from a different from a more trusted
manufacturer in the more proven thru-hole package and to be done by
hand so it's outside of oven reflow, water-wash, and conformal coat
process.

Looking for further ideas and info on this type of problem at this
point?
 
"Terry Moreau" <tmoreau@teleflex.bc.ca> wrote in message
news:70881d03.0407231156.119cd545@posting.google.com...
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
terminal. This is causing a full inventory re-work and even a field
recall of over 1,000 finished assemblies. Serious and expensive
problem to say the least. It's looking like water/solvent has gotten
into a good percentage of these SMD resonators. Specifically its ECS
part#ECS-SR1-4.00 . The electrical leakage appears to be affected by
dc bias voltage (increasing leakage current the longer any DC bias
voltage is applied for, while the leakage reduces almost to nothing if
the DC bias is removed and the part is let to stand for several
hours). Seems to me to behave like a sort of electrolysis type of
conduction.

I'm aksing if anyone has any experience with this problem with anyway,
that they can share.

Best theories so far are:

1. Solder profile is too hot or for too long and ceramic SMD package
seal is compromised. Susequent water wash flux removal is letting
flux laden water into the resonators delicate internals where some
closely spaced electrode metalization path air gaps are being filled
with party conductive ionize solution. The solution evaporates and
super saturates down to a "goo" where it never completely dries out to
a non-conductive state. Compounded by the fact that the resonator is
on a board that gets conformal coated. Trapped moisture is then
sealed in!

3. The water wash cycle is too long and/or the board is not
sufficiently dried and/or gets conformal coated before it's completely
dried. The porosity of the ceramic is enough to let some moisture
into the resonator internals where it straddles electrodes and
provides an electrically leaky conduction path.

2. The solvent in the conformal coating (hexamethyldisiloxane) is
either attacking the ceramic package seal material, or is simply over
time diffusing into the partially porous ceramic package? Again,
collecting/depositing inbetween small spaced internal electrodes and
provide an electrically leaky conductive path.

The resonator is used in a typical +5V CPU oscillator circuit with
about 500K feedback resistor internal to the CPU. Leakage spec for
the part are > 100Meg ohms at 10volts, however I get anywhere from 4K
to 4Meg ohms leakage at 2.5Volts.

I never get the problem on a fresh resonator out of the tape/real
package.

The problem is showing up in about 10% of boards and it may be
anything from days to months of operation before the leakage level is
bad enough that the CPU oscillator dies.

Short term I've halted production and ordered rework of all boards to
switch to a different resonator from a different from a more trusted
manufacturer in the more proven thru-hole package and to be done by
hand so it's outside of oven reflow, water-wash, and conformal coat
process.

Looking for further ideas and info on this type of problem at this
point?
These things are touch-and-go at the best of times. What you need to do is
follow the manufactures instructions on the datasheet exactly. You should
also contact the manufacturer regarding your choice of conformal coating.

May I also add that you should NEVER use ultrasonic cleaning for flux
removal if you use SMD resonators. I highly suggest a trip to you board
manufacturer to oversee exactly how they are manuafturing these devices.
Dont take their word for and make sure you watch over as they are putting
the pcb through its processes.
 
I read in sci.electronics.design that Terry Moreau
<tmoreau@teleflex.bc.ca> wrote (in <70881d03.0407231156.119cd545@posting
..google.com>) about 'ceramic resonators gone electrically leaky?', on
Fri, 23 Jul 2004:

The solvent in the conformal coating (hexamethyldisiloxane) is
either attacking the ceramic package seal material, or is simply over
time diffusing into the partially porous ceramic package? Again,
collecting/depositing inbetween small spaced internal electrodes and
provide an electrically leaky conductive path.
I think you will find that hexamethyldisiloxane is not a good conductor
and does not attack ceramic. I can't access the relevant data on the web
for some reason; I get an ASP error.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk
 
In article <70881d03.0407231156.119cd545@posting.google.com>, Terry
Moreau <tmoreau@teleflex.bc.ca> writes
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
Just possible that you are overdriving to the extent that the ceramic is
showing micro fracture and migration of the electrodes.
There will be a level at which this occurs.
 
ddwyer <dd@ddwyer.demon.co.uk> wrote in message news:<L9$inIAzfABBFwVk@ddwyer.demon.co.uk>...
In article <70881d03.0407231156.119cd545@posting.google.com>, Terry
Moreau <tmoreau@teleflex.bc.ca> writes
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground

Just possible that you are overdriving to the extent that the ceramic is
showing micro fracture and migration of the electrodes.
There will be a level at which this occurs.
Good point and I thought of something like aswell because I've seen
that problem with xtal oscillators. There is no manufacturer's power
rating for the ceramic resonator and the typical first layer
applications engineer has no idea either (duh! was his answer). I do
see applications notes for the device showing 5VDC oscillator requires
no series resistor to drop power level. I'm currently running a test
24/7 where I have several of the these resonators running at
30Vpeak-peak in a transistor oscillator circuit and at 100C ambient.
I come a long now and then and shoot the resonators with -40C cold
spray to induce thermal shock. Even at this overdrive power level of
6 times factor, and extreme thermal cycling...not one is failed or
showing up leaky. I'll let the test run a few more days but I'm
thinking that's not what's going on in my particualr case?
 
John Woodgate <jmw@jmwa.demon.contraspam.yuk> wrote in message news:<lkucfoHuZXABFwpx@jmwa.demon.co.uk>...
I read in sci.electronics.design that Terry Moreau
tmoreau@teleflex.bc.ca> wrote (in <70881d03.0407231156.119cd545@posting
.google.com>) about 'ceramic resonators gone electrically leaky?', on
Fri, 23 Jul 2004:

The solvent in the conformal coating (hexamethyldisiloxane) is
either attacking the ceramic package seal material, or is simply over
time diffusing into the partially porous ceramic package? Again,
collecting/depositing inbetween small spaced internal electrodes and
provide an electrically leaky conductive path.

I think you will find that hexamethyldisiloxane is not a good conductor
and does not attack ceramic. I can't access the relevant data on the web
for some reason; I get an ASP error.
Thank you to check into this John and report your findings!

I have some of the solvent and some of the conformal coat in liquid
state. It's not at all conductive. Even if you add water. Water
washable flux solution however, once evaporated to a high
concentration, is highly conductive I found. Worse even...it's acidic
and over time and at high temperature will attack tin/silver/copper
etc.. disolving them into solution as free ions able to conduct as
well.

The theory I had was based on the fact that these SMD cermaic
resonator come in a two part package...the ceramic lid is "glued" onto
the ceramic base. That particular glue might be prone to damage by
too much heat, thermal shock, chemical attack?

Additional Comments????
 
"Andrew" <a.pearson@no.spam.aasiascales.com.au> wrote in message news:<410172e7$1@dnews.tpgi.com.au>...
"Terry Moreau" <tmoreau@teleflex.bc.ca> wrote in message
news:70881d03.0407231156.119cd545@posting.google.com...
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
terminal. This is causing a full inventory re-work and even a field
...snip...


These things are touch-and-go at the best of times. What you need to do is
follow the manufactures instructions on the datasheet exactly. You should
also contact the manufacturer regarding your choice of conformal coating.

May I also add that you should NEVER use ultrasonic cleaning for flux
removal if you use SMD resonators. I highly suggest a trip to you board
manufacturer to oversee exactly how they are manuafturing these devices.
Dont take their word for and make sure you watch over as they are putting
the pcb through its processes.

Excellent pracital sounding advice and experience you share, thanks!

I'm curious is the ultrasonic clean because it my "energize" the
resonator, or is it because it weakens package seal??? or both? or
you're not sure but have seen ultrasonic cleaning realted problems
before? Can you please share some specific examples perhaps?
 
I read in sci.electronics.design that Terry Moreau
<tmoreau@teleflex.bc.ca> wrote (in <70881d03.0407261218.49a5467@posting.
google.com>) about 'ceramic resonators gone electrically leaky?', on
Mon, 26 Jul 2004:
Water
washable flux solution however, once evaporated to a high concentration,
is highly conductive I found. Worse even...it's acidic and over time
and at high temperature will attack tin/silver/copper etc.. disolving
them into solution as free ions able to conduct as well.
REALLY acidic if it attacks silver!
The theory I had was based on the fact that these SMD cermaic resonator
come in a two part package...the ceramic lid is "glued" onto the ceramic
base. That particular glue might be prone to damage by too much heat,
thermal shock, chemical attack?
Yes, of course it might; you would have to ask the manufacturer.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk
 
On 26 Jul 2004 13:22:17 -0700, tmoreau@teleflex.bc.ca (Terry Moreau)
wrote:

"Andrew" <a.pearson@no.spam.aasiascales.com.au> wrote in message news:<410172e7$1@dnews.tpgi.com.au>...
"Terry Moreau" <tmoreau@teleflex.bc.ca> wrote in message
news:70881d03.0407231156.119cd545@posting.google.com...
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
terminal. This is causing a full inventory re-work and even a field
...snip...


These things are touch-and-go at the best of times. What you need to do is
follow the manufactures instructions on the datasheet exactly. You should
also contact the manufacturer regarding your choice of conformal coating.

May I also add that you should NEVER use ultrasonic cleaning for flux
removal if you use SMD resonators. I highly suggest a trip to you board
manufacturer to oversee exactly how they are manuafturing these devices.
Dont take their word for and make sure you watch over as they are putting
the pcb through its processes.


Excellent pracital sounding advice and experience you share, thanks!

I'm curious is the ultrasonic clean because it my "energize" the
resonator, or is it because it weakens package seal??? or both? or
you're not sure but have seen ultrasonic cleaning realted problems
before? Can you please share some specific examples perhaps?
Got no idea why the ultrasonic cleaning causes problems, but I had
this problem before. I also noticed that the manufacturer had
explicitly specified no ultrasonic cleaning, and I didn't find a
solution to the problem until I actually made a personal visit to the
the board house.

What I can tell you however, is that it does weaken the seal, to the
point where a small tap would cause the lid of the resonator to fall
off.

I dont do a whole lot of hardware design these days. but when I do I
try stick with leaded resonators as they seem more rugged. Sometime
space will not permit though.
 
tmoreau@teleflex.bc.ca (Terry Moreau) wrote in message news:<70881d03.0407231156.119cd545@posting.google.com>...
SMD packaged ceramic resonators from ECS are showing up electrically
leaky in from one of the in/out terminals to the central ground
terminal. This is causing a full inventory re-work and even a field
recall of over 1,000 finished assemblies. Serious and expensive
problem to say the least. It's looking like water/solvent has gotten
into a good percentage of these SMD resonators. Specifically its ECS
part#ECS-SR1-4.00 . The electrical leakage appears to be affected by
dc bias voltage (increasing leakage current the longer any DC bias
voltage is applied for, while the leakage reduces almost to nothing if
the DC bias is removed and the part is let to stand for several
hours). Seems to me to behave like a sort of electrolysis type of
conduction.

I'm aksing if anyone has any experience with this problem with anyway,
that they can share.

Best theories so far are:

1. Solder profile is too hot or for too long and ceramic SMD package
seal is compromised. Susequent water wash flux removal is letting
flux laden water into the resonators delicate internals where some
closely spaced electrode metalization path air gaps are being filled
with party conductive ionize solution. The solution evaporates and
super saturates down to a "goo" where it never completely dries out to
a non-conductive state. Compounded by the fact that the resonator is
on a board that gets conformal coated. Trapped moisture is then
sealed in!

3. The water wash cycle is too long and/or the board is not
sufficiently dried and/or gets conformal coated before it's completely
dried. The porosity of the ceramic is enough to let some moisture
into the resonator internals where it straddles electrodes and
provides an electrically leaky conduction path.

2. The solvent in the conformal coating (hexamethyldisiloxane) is
either attacking the ceramic package seal material, or is simply over
time diffusing into the partially porous ceramic package? Again,
collecting/depositing inbetween small spaced internal electrodes and
provide an electrically leaky conductive path.

The resonator is used in a typical +5V CPU oscillator circuit with
about 500K feedback resistor internal to the CPU. Leakage spec for
the part are > 100Meg ohms at 10volts, however I get anywhere from 4K
to 4Meg ohms leakage at 2.5Volts.

I never get the problem on a fresh resonator out of the tape/real
package.

The problem is showing up in about 10% of boards and it may be
anything from days to months of operation before the leakage level is
bad enough that the CPU oscillator dies.

Short term I've halted production and ordered rework of all boards to
switch to a different resonator from a different from a more trusted
manufacturer in the more proven thru-hole package and to be done by
hand so it's outside of oven reflow, water-wash, and conformal coat
process.

Looking for further ideas and info on this type of problem at this
point?

OK, I will put in my 2 cents worth here - please note, I am NOT an
engineer but a technician who spends his working life fixing things
like this - usually AFTER any warranty has expired.

From your susequent posts, you have tested the resonators to an
extreme level with no problems, ergo the problem lies in the PCB
assembly process - something has gone wrong in the assembly plant. Its
their problem, and ISO standards (if they are certified) SHOULD
provide detailed documentation of the whole process -it may be the
documentation is prepared in a nice clean office far away from the
operator who turned up the temp control on the machine, and if so you
are stuffed.

hopefully, the PCB manufacturer is reputable/respnsible and has some
sort of QA procedure so I suggest you shove it back to them, get the
problem fixed, and worry about the physics/chemistry of the failure
mode later. And absolutely no disrespect to the people who can do this
sort of analysis - I cant, I just fix faults!

73 de VK3BFA Andrew
 

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