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Call for Papers: The 2013 IAENG International Conference on
Engineering Physics (ICEP13)
CFP: The 2013 IAENG International Conference on Engineering Physics
(ICEP13)
Draft Manuscript submission deadline: 8 December, 2012
Camera-Ready papers & registration deadline: 10 January, 2013
ICEP 2013: Hong Kong, 13-15 March, 2013
http://www.iaeng.org/IMECS2013/ICEP2013.html
The conference ICEP'13 is held under the International MultiConference
of Engineers and Computer Scientists (IMECS) 2013. The IMECS 2013 is
organized by the International Association of Engineers (IAENG), a non-
profit international association for the engineers and the computer
scientists. The conference has the focus on the frontier topics in the
theoretical and applied engineering and computer science subjects. The
IMECS conferences serve as good platforms for our members and the
entire engineering community to meet with each other and to exchange
ideas. Our IMECS committees have been formed with over two hundred and
sixty committees members who are mainly research center heads, faculty
deans, department heads, professors, and research scientists from over
30 countries. The last IMECS 2012 has attracted more than eight
hundred participants from over 50 countries.
All submitted papers will be under peer review and accepted papers
will be published in the conference proceeding (ISBN:
978-988-19251-8-3). Revised and expanded version of the selected
papers may be included as book chapters in the standalone edited books
under the framework of cooperation between IAENG and publishers like
Springer. The abstracts will be indexed and available at major
academic databases. The accepted papers will also be considered for
publication in the special issues of the journal Engineering Letters,
in IAENG journals and in edited books. For reference, the recent IAENG
post conference edited books include titles like for example: Trends
in Intelligent Systems and Computer Engineering, Advances in
Communication Systems and Electrical Engineering, and Advances in
Industrial Engineering and Operations Research by Springer.
The topics of the ICEP'13 include, but not limited to, the following:
Automation and instrumentation
Methods for physical analysis and measurement
Modeling and simulation
Computational physics
Micro- and nano-technology
Sensor materials and devices
Magnetic materials
Optoelectronics and photonics
Plasma physics and optics
Superconducting materials
Condensed matter
Solid-state physics
Nuclear physics and engineering
Applied mechanics
General physics and physics education
Mineralogy and radiology
Medical physics and biophysics
Industrial physics
Applications of engineering physics
========Submission:
IMECS 2013 is now accepting manuscript submissions. Prospective
authors are invited to submit their draft paper in full paper (any
appropriate style) to imecs{at}iaeng.org. The submitted file can be in
MS Word format, PS format, or PDF formats.
The first page of the draft paper should include:
(1) Title of the paper;
(2) Name, affiliation and e-mail address for each author;
(3) A maximum of 5 keywords of the paper.
Also, the name of the conference that the paper is being submitted to
should be stated in the email.
It is our target that the reviewing process and the result
notification for each submitted manuscript can be completed within one
month from its submission. The reviewing process is to ensure the
quality of the accepted papers in the conference.
More details about the IMECS 2013 can be found at:
http://www.iaeng.org/IMECS2013/index.html
More details about the International Association of Engineers, and the
IAENG International Journal of Computer Science, and the IAENG
International Journal of Applied Mathematics can be found at:
http://www.iaeng.org/about_IAENG.html
http://www.iaeng.org/IJCS/index.html
http://www.iaeng.org/IJAM/index.html
The official journal web site of Engineering Letters at:
http://www.engineeringletters.com
http://www.engineeringletters.net
http://www.engineeringletter.com
********
It will be highly appreciated if you can circulate these calls for
papers to your colleagues.
Engineering Physics (ICEP13)
CFP: The 2013 IAENG International Conference on Engineering Physics
(ICEP13)
Draft Manuscript submission deadline: 8 December, 2012
Camera-Ready papers & registration deadline: 10 January, 2013
ICEP 2013: Hong Kong, 13-15 March, 2013
http://www.iaeng.org/IMECS2013/ICEP2013.html
The conference ICEP'13 is held under the International MultiConference
of Engineers and Computer Scientists (IMECS) 2013. The IMECS 2013 is
organized by the International Association of Engineers (IAENG), a non-
profit international association for the engineers and the computer
scientists. The conference has the focus on the frontier topics in the
theoretical and applied engineering and computer science subjects. The
IMECS conferences serve as good platforms for our members and the
entire engineering community to meet with each other and to exchange
ideas. Our IMECS committees have been formed with over two hundred and
sixty committees members who are mainly research center heads, faculty
deans, department heads, professors, and research scientists from over
30 countries. The last IMECS 2012 has attracted more than eight
hundred participants from over 50 countries.
All submitted papers will be under peer review and accepted papers
will be published in the conference proceeding (ISBN:
978-988-19251-8-3). Revised and expanded version of the selected
papers may be included as book chapters in the standalone edited books
under the framework of cooperation between IAENG and publishers like
Springer. The abstracts will be indexed and available at major
academic databases. The accepted papers will also be considered for
publication in the special issues of the journal Engineering Letters,
in IAENG journals and in edited books. For reference, the recent IAENG
post conference edited books include titles like for example: Trends
in Intelligent Systems and Computer Engineering, Advances in
Communication Systems and Electrical Engineering, and Advances in
Industrial Engineering and Operations Research by Springer.
The topics of the ICEP'13 include, but not limited to, the following:
Automation and instrumentation
Methods for physical analysis and measurement
Modeling and simulation
Computational physics
Micro- and nano-technology
Sensor materials and devices
Magnetic materials
Optoelectronics and photonics
Plasma physics and optics
Superconducting materials
Condensed matter
Solid-state physics
Nuclear physics and engineering
Applied mechanics
General physics and physics education
Mineralogy and radiology
Medical physics and biophysics
Industrial physics
Applications of engineering physics
========Submission:
IMECS 2013 is now accepting manuscript submissions. Prospective
authors are invited to submit their draft paper in full paper (any
appropriate style) to imecs{at}iaeng.org. The submitted file can be in
MS Word format, PS format, or PDF formats.
The first page of the draft paper should include:
(1) Title of the paper;
(2) Name, affiliation and e-mail address for each author;
(3) A maximum of 5 keywords of the paper.
Also, the name of the conference that the paper is being submitted to
should be stated in the email.
It is our target that the reviewing process and the result
notification for each submitted manuscript can be completed within one
month from its submission. The reviewing process is to ensure the
quality of the accepted papers in the conference.
More details about the IMECS 2013 can be found at:
http://www.iaeng.org/IMECS2013/index.html
More details about the International Association of Engineers, and the
IAENG International Journal of Computer Science, and the IAENG
International Journal of Applied Mathematics can be found at:
http://www.iaeng.org/about_IAENG.html
http://www.iaeng.org/IJCS/index.html
http://www.iaeng.org/IJAM/index.html
The official journal web site of Engineering Letters at:
http://www.engineeringletters.com
http://www.engineeringletters.net
http://www.engineeringletter.com
********
It will be highly appreciated if you can circulate these calls for
papers to your colleagues.