Call for Papers: The 2013 IAENG International Confer ence on

[iaeng_imecs_wce_wcecs_a]

Call for Papers: The 2013 IAENG International Conference on Electrical
Engineering (ICEE’13)

CFP: The 2013 IAENG International Conference on Electrical Engineering
(ICEE’13)
Draft Manuscript submission deadline: 8 December, 2012
Camera-Ready papers & registration deadline: 10 January, 2013
ICEE 2013: Hong Kong, 13-15 March, 2013
http://www.iaeng.org/IMECS2013/ICEE2013.html

The conference ICEE'13 is held under the International MultiConference
of Engineers and Computer Scientists (IMECS) 2013. The IMECS 2013 is
organized by the International Association of Engineers (IAENG), a non-
profit international association for the engineers and the computer
scientists. The conference has the focus on the frontier topics in the
theoretical and applied engineering and computer science subjects. The
IMECS conferences serve as good platforms for our members and the
entire engineering community to meet with each other and to exchange
ideas. Our IMECS committees have been formed with over two hundred and
sixty committees members who are mainly research center heads, faculty
deans, department heads, professors, and research scientists from over
30 countries. The last IMECS 2012 has attracted more than eight
hundred participants from over 50 countries.

All submitted papers will be under peer review and accepted papers
will be published in the conference proceeding (ISBN:
978-988-19251-8-3). Revised and expanded version of the selected
papers may be included as book chapters in the standalone edited books
under the framework of cooperation between IAENG and publishers like
Springer. The abstracts will be indexed and available at major
academic databases. The accepted papers will also be considered for
publication in the special issues of the journal Engineering Letters,
in IAENG journals and in edited books. For reference, the recent IAENG
post conference edited books include titles like for example: Trends
in Intelligent Systems and Computer Engineering, Advances in
Communication Systems and Electrical Engineering, and Advances in
Industrial Engineering and Operations Research by Springer.


The topics of the ICEE'13 include, but not limited to, the following:

Biotechnology: such as EEG, ECG, and EKG, various other monitoring
equipment

Electronics: such as integrated circuit, computer, electronic
amplifier

Power engineering: such as electrical generators, electric power
transmission

Telecommunication: such as television, radio, mobile phone, optical
multiple access technologies

Control engineering: such as auto pilot, cruise control, climate
control, space exploration, smart bomb

Signal processing: such as electronic filter, digital filter, video
and audio codec, radar, sonar, beamforming

Special Session: Design, Analysis and Tools for Integrated Circuits
and Systems (DATICS'13)


ICEE Conference Co-Chairs and Committee Members:

Dr. Maaruf Ali
Senior Lecturer in Telecommunications Engineering & Media
Technology,
Department of Electronic Engineering, School of Technology, Oxford
Brookes University, UK;
Vice-chair of the IEE Berkshire Specialist Branch on Electronics,
Control, Computing and Communications

Prof. Aissa Boudjella
Associate professor, Faculty of Information and Communication
Technology, Universiti Tunku Abdul Rahman (UTAR), Malaysia

Mu-Song Chen (co-chair)
Associate Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

Yen-Wen Chen
Associate Professor, Dept. of Communication Engineering
National Central University, Taiwan

Yung-Sheng Chen
Professor, Electrical Engineering Department
Yuan Ze University, Taiwan

Jong-Sheng Cherng
Assistant Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

T.S. Chung, FIEE (co-chair)
Professor, Electrical Engineering Department
The Hong Kong Polytechnic University, Hong Kong

Hung-Yuan Chung
Professor, Department of Electrical Engineering, National Central
University, Taiwan

Yi-Nung Chung (co-chair)
Associate Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

Chun-Fei Hsu
Assistant Professor of Electrical Engineering,
Department of Electrical Engineering, Tamkang University, Taiwan

Feng-Li Lian
Assistant Professor, Department of Electrical Engineering
National Taiwan University, Taiwan

Chih-Min Lin (co-chair)
Chairman and Professor
Department of Electrical Engineering
Yuan-Ze University, Taiwan

Prof. K.L. Man
Professor, Dept. of Computer Science & Software Engineering, Xi'an
Jiaotong-Liverpool University, China

Dr. Tsao-Tsung Ma
Dept. of Electrical Engineering, National United University, Taiwan

Prof. A.B. Rad (co-chair)
Professor, Faculty of Engineering and Industrial Sciences
Swinburne University of Technology, Australia

Wen-Jye Shyr
Assistant Professor, Department of Industrial Education and
Technology,
National Changhua University of Education, Taiwan

Huan-liang Tsai
Associate Professor, Department of Electrical Engineering, Da-Yeh
University, Taiwan

Tsung-Han Tsai (co-chair)
Associate Professor, Dept. of Electrical Engineering
National Central University, Taiwan

Rong-Jong Wai
Professor, Department of Electrical Engineering,
Yuan Ze University, Taiwan

G.C. Yang
Professor, Department of Electrical Engineering
National ChungHsing University, Taiwan



Special Session DATICS Chairman and Committee Members:


GENERAL CHAIRS
•Ka Lok Man, Xi'an Jiaotong-Liverpool University (China)
•Nan Zhang, Xi'an Jiaotong-Liverpool University (China)



Organising Chairs

•Michele Mercaldi, EnvEve, Switzerland
•Chi-Hua Chen, National Chiao Tung University, Taiwan
•Tomas Krilavičius, Baltic Institute of Advanced Technologies and
Vytautas Magnus University, Lithuania




INTERNATIONAL PROGRAM COMMITTEE
•Vladimir Hahanov, Kharkov National University of Radio Electronics,
Ukraine
•Paolo Prinetto, Politecnico di Torino, Italy
•Massimo Poncino, Politecnico di Torino, Italy
•Alberto Macii, Politecnico di Torino, Italy
•Joongho Choi, University of Seoul, South Korea
•Wei Li, Fudan University, China
•Michel Schellekens, University College Cork, Ireland
•Emanuel Popovici, University College Cork, Ireland
•Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center,
South Korea
•Umberto Rossi, STMicroelectronics, Italy
•Franco Fummi, University of Verona, Italy
•Graziano Pravadelli, University of Verona, Italy
•Yui Fai Lam, Hong Kong University of Science and Technology, Hong
Kong
•Vladimir PavLov, International Software and Productivity Engineering
Institute, USA
•Ajay Patel, Intelligent Support Ltd, United Kingdom
•Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The
Netherlands
•Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
•Monica Donno, Minteos, Italy
•Jun-Dong Cho, Sung Kyun Kwan University, South Korea
•AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
•Gregory Provan, University College Cork, Ireland
•Miroslav N. Velev, Aries Design Automation, USA
•M. Nasir Uddin, Lakehead University, Canada
•Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
•Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
•John Herbert, University College Cork, Ireland
•Zhe-Ming Lu, Sun Yat-Sen University, China
•Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences,
Taiwan
•Chin-Chen Chang, Feng Chia University, Taiwan
•Mong-Fong Horng, Shu-Te University, Taiwan
•Liang Chen, University of Northern British Columbia, Canada
•Chee-Peng Lim, University of Science Malaysia, Malaysia
•Salah Merniz, Mentouri University, Constantine, Algeria
•Oscar Valero, University of Balearic Islands, Spain
•Yang Yi, Sun Yat-Sen University, China
•Damien Woods, University of Seville, Spain
•Franck Vedrine, CEA LIST, France
•Bruno Monsuez, ENSTA, France
•Kang Yen, Florida International University, USA
•Takenobu Matsuura, Tokai University, Japan
•R. Timothy Edwards, MultiGiG, Inc., USA
•Olga Tveretina, Karlsruhe University, Germany
•Maria Helena Fino, Universidade Nova De Lisboa, Portugal
•Adrian Patrick ORiordan, University College Cork, Ireland
•Grzegorz Labiak, University of Zielona Gora, Poland
•Jian Chang, Texas Instruments, Inc, USA
•Yeh-Ching Chung, National Tsing-Hua University, Taiwan
•Anna Derezinska, Warsaw University of Technology, Poland
•Kyoung-Rok Cho, Chungbuk National University, South Korea
•Yuanyuan Zeng, Wuhan university, China
•D.P. Vasudevan, University College Cork, Ireland
•Arkadiusz Bukowiec, University of Zielona Gora, Poland
•Maziar Goudarzi, Sharif University of Technology, Iran
•Jin Song Dong, National University of Singapore, Singapore
•Dhamin Al-Khalili, Royal Military College of Canada, Canada
•Zainalabedin Navabi, University of Tehran, Iran
•Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
•Muhammad Almas Anjum, National University of Sciences and Technology
(NUST), Pakistan
•Deepak Laxmi Narasimha, University of Malaya, Malaysia
•Danny Hughes, Katholieke Universiteit Leuven, Belgium
•Jun Wang, Fujitsu Laboratories of America, Inc., USA
•A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
•N. Jaisankar, VIT University. India
•Atif Mansoor, National University of Sciences and Technology (NUST),
Pakistan
•Steven Hollands, Synopsys, Ireland
•Siamak Mohammadi, University of Tehran, Iran
•Felipe Klein, State University of Campinas (UNICAMP), Brazil
•Enggee Lim, Xi'an Jiaotong-Liverpool University, China
•Kevin Lee, Murdoch University, Australia
•Prabhat Mahanti, University of New Brunswick, Saint John, Canada
•Kaiyu Wan, Xi'an Jiaotong-Liverpool University, China
•Tammam Tillo, Xi'an Jiaotong-Liverpool University, China
•Yanyan Wu, Xi'an Jiaotong-Liverpool University, China
•Wen Chang Huang, Kun Shan University, Taiwan
•Masahiro Sasaki, The University of Tokyo, Japan
•Shishir K. Shandilya, NRI Institute of Information Science &
Technology, India
•J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
•Wichian Sittiprapaporn, Mahasarakham University, Thailand
•Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
•Kevin Marquet, Verimag Laboratory, France
•Matthieu Moy, Verimag Laboratory, France
•Ramy Iskander, LIP6 Laboratory, France
•Suryaprasad Jayadevappa, PES School of Engineering, India
•Shanmugasundaram Hariharan, Pavendar Bharathidasan College of
Engineering and Technology, India
•Chung-Ho Chen, National Cheng-Kung University, Taiwan
•Kyung Ki Kim, Daegu University, Korea
•Shiho Kim, Chungbuk National University, Korea
•Hi Seok Kim, Cheongju University, Korea
•Brian Logan, University of Nottingham, UK
•Ben Kwang-Mong Sim, Gwangju Institute of Science & Technology, Korea
•Asoke Nath, St. Xavier's College (Autonomous), India
•Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
•Shin-Ya Takahasi, Fukuoka University, Japan
•Cheng C. Liu, University of Wisconsin at Stout, USA
•Farhan Siddiqui, Walden University, Minneapolis, USA
•Katsumi Wasaki, Shinshu University, Japan
•Pankaj Gupta, Microsoft Corporation, USA
•Taikyeong Jeong, Myongji University, South Korea
•Masoud Daneshtalab, University of Turku, Finland
•Amit Chaudhry, Technology Panjab University, India
•Bharat Bhushan Agarwal, I.F.T.M., University, India
•Abhilash Goyal, Oracle (SunMicrosystems), USA
•Yue Yang, EJITEC, China
•Boguslaw Cyganek, AGH University of Science and Technology, Poland
•Yeo Kiat Seng, Nanyang Technological University, Singapore
•Youngmin Kim, UNIST Academy-Industry Research Corporation, South
Korea
•Tom English, Xlinx, Ireland
•Nicolas Vallee, RATP, France
•Mou Ling Dennis Wong, Xi'an Jiatong Liverpool University, China
•Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
•Xuan Guan, Freescale Semiconductor, Austin, TX, USA
•Pradip Kumar Sadhu, Indian School of Mines, India



INTERNATIONAL REVIEWERS
•Miquel Moreto Planas, Technical University of Catalonia, Spain
•Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial
Systems, South Korea
•Luigi Giancardi, Devoteam auSystems SpA, Italy
•Alie El-Din Mady, University College Cork, Ireland
•Prasad D. Khandekar Vishwakarma Institute of Information Technology,
Pune
•Hari Mohan Pandey, SVKM's NMIMS University, India
•Vishal Bharti, Dronacharya College of Engineering, Khentawas,
Gurgaon, India
•Yiwang Wang, Suzhou Vocational University, China
•Chao Lu, Purdue University, USA
•Pavan Kumar Manchikalapudi, MNNIT, India
•Puneet Sareen, Texas Instruments, Germany
•Ben L Zhou, Tabula, USA
•Razan Paul, Bangladesh University of Engineering and Technology,
Bangladesh
•Farakh Javid, LIP6 Laboratory, France
•Sushil Menon, PES School of Engineering, India
•Khalid Latif, University of Turku, Finland
•Masoumeh Ebrahimi, University of Turku, Finland


========Submission:

IMECS 2013 is now accepting manuscript submissions. Prospective
authors are invited to submit their draft paper in full paper (any
appropriate style) to imecs{at}iaeng.org. The submitted file can be in
MS Word format, PS format, or PDF formats.

The first page of the draft paper should include:
(1) Title of the paper;
(2) Name, affiliation and e-mail address for each author;
(3) A maximum of 5 keywords of the paper.
Also, the name of the conference that the paper is being submitted to
should be stated in the email.

It is our target that the reviewing process and the result
notification for each submitted manuscript can be completed within one
month from its submission. The reviewing process is to ensure the
quality of the accepted papers in the conference.


More details about the IMECS 2013 can be found at:
http://www.iaeng.org/IMECS2013/index.html

More details about the International Association of Engineers, and the
IAENG International Journal of Computer Science, and the IAENG
International Journal of Applied Mathematics can be found at:
http://www.iaeng.org/about_IAENG.html
http://www.iaeng.org/IJCS/index.html
http://www.iaeng.org/IJAM/index.html
The official journal web site of Engineering Letters at:
http://www.engineeringletters.com
http://www.engineeringletters.net
http://www.engineeringletter.com

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It will be highly appreciated if you can circulate these calls for
papers to your colleagues.