Bending a SIP package

Hi,

I have an IC with a 23-Pin SIP package (http://
eportal.apexmicrotech.com/mainsite/pdf/EX.pdf). The problem is that
the available package is vertical, and I need it horizental.
To solve this, I am thinking about, first, slodering the IC, then
bending it down. However, I am afarid that some of the pins might ge
disconneted, and the IC is expenisve.

Does somebody have some experince with this?

Thanks,
JJ

 

On Jun 24, 6:55 pm, jid...@hotmail.com wrote:

To solve this, I am thinking about, first, slodering the IC, then
bending it down. However, I am afarid that some of the pins might ge
disconneted, and the IC is expenisve.

If you do it this way, you stress the point where the leadframe enters
the package. It is better to put the pins in a vise and bend down the
loose ends.

 

[TT_Man]

<zwsdotcom@gmail.com> wrote in message
news:1182726426.472092.6090@w5g2000hsg.googlegroups.com...

On Jun 24, 6:55 pm, jid...@hotmail.com wrote:

To solve this, I am thinking about, first, slodering the IC, then
bending it down. However, I am afarid that some of the pins might ge
disconneted, and the IC is expenisve.

If you do it this way, you stress the point where the leadframe enters
the package. It is better to put the pins in a vise and bend down the
loose ends.

yes, bend the pins first, then solder.

 

[Lostgallifreyan]

jidan1@hotmail.com wrote in
news:1182725735.245828.208580@o61g2000hsh.googlegroups.com:

Hi,

I have an IC with a 23-Pin SIP package (http://
eportal.apexmicrotech.com/mainsite/pdf/EX.pdf). The problem is that
the available package is vertical, and I need it horizental.
To solve this, I am thinking about, first, slodering the IC, then
bending it down. However, I am afarid that some of the pins might ge
disconneted, and the IC is expenisve.

Does somebody have some experince with this?

Thanks,
JJ

If you have good access to the space behind the IC, you can bend it into
place after soldering it. If it were surface mount, only bending before
soldering makes sense, but in this case it might be easier to do it
afterwards.

First point to note is that whichever way you go first, the stress on the
IC package from any lead can be the same, so to protect the package as a
whole you just need to maintain an even strain, and doing it after
soldering makes this easier for this IC.

If you look at the pins in the profile diagram, you can see that there is a
bend just after they leave the package, after the bend the pins take one of
two forms. What you need is two stainless steel rulers or similar objects.
Place the end of one so that the upper edge presses firmly against the
outside of the bend, and one end of the other flat against the front of the
IC. Guide it like a hinge, applying pressure so that the centre of rotation
is on the point where the bend rests on the first ruler, NOT around the
point where the pins enter the IC. This will start to straighten out that
bend, and when the IC is near-flat you can remove the first ruler. You
won't get it fully flat without clamping, unless you reflow the solder
joints while temporarily holding the IC flat.